MAX2066ETL+T Maxim Integrated Products, MAX2066ETL+T Datasheet - Page 2

• Manufacturer Part Number: MAX2066ETL+T
• Description: RF Amplifier IC VGA PROG DIGITAL-EP
• Manufacturer: Maxim Integrated Products

Specifications of MAX2066ETL+T

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Digital VGA
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND ........................................................-0.3V to +5.5V
VDD_LOGIC, DATA, CS, CLK,
STATE_A, STATE_B, D0–D4 ....................-0.3V to (VCC_ + 0.3V)
AMP_IN, AMP_OUT .................................-0.3V to (VCC_ + 0.3V)
ATTEN_IN, ATTEN_OUT........................................-1.2V to +1.2V
RSET to GND.........................................................-0.3V to +1.2V
RF Input Power (ATTEN_IN, ATTEN_OUT).....................+20dBm
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , high-current (HC) mode, V
V
+5V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
T
Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
Note 4: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
LOGIC INPUTS (DATA, CS, CLK, SER/PAR, STATE_A, STATE_B, D0–D4)
Input High Voltage
Input Low Voltage
Supply Voltage
Supply Current
LOGIC INPUTS (DATA, CS, CLK, SER/PAR, STATE_A, STATE_B, D0–D4)
Input High Voltage
Input Low Voltage
Input Current Logic-High
Input Current Logic-Low
DD
C
SER/PAR..............................................-0.3V to (VCC_ + 0.3V)
= +25°C, unless otherwise noted.)
_______________________________________________________________________________________
= +3.3V and T
pad is known while the device is soldered down to a printed-circuit board (PCB). See the Applications Information section
for details. The junction temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
PARAMETER
is the temperature on the exposed pad of the package. T
C
= +25°C, unless otherwise noted.)
CC
J
= T
= V
A
SYMBOL
SYMBOL
DD
+ (θ
V
V
I
I
V
V
V
V
I
CC
CC
I
J
CC
CC
IH
= +4.75V to +5.25V, T
IL
IH
IH
IL
IL
JA
= T
x V
C
+ (θ
CC
(Note 5)
Low-current (LC) mode
High-current (HC) mode
x I
JC
CC
CC
x V
). This formula can be used when the ambient temperature of the PCB is
= V
CC
x I
DD
CC
CONDITIONS
CONDITIONS
C
= +3.0V to +3.6V, T
). This formula can be used when the temperature of the exposed
= -40°C to +85°C. Typical values are at V
A
RF Input Power (AMP_IN)...............................................+18dBm
Continuous Power Dissipation (Note 1) ...............................6.5W
θ
θ
Operating Temperature Range (Note 4) .....T
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
JA
JC
is the ambient temperature of the device and PCB.
(Notes 2, 3)..............................................................+38°C/W
(Note 3) ...................................................................+10°C/W
C
= -40°C to +85°C. Typical values are at V
4.75
MIN
MIN
3.0
-1
-1
3
TYP
TYP
121
3.3
0.8
58
70
2
5
CC
C
= V
= -40°C to +85°C
MAX
MAX
5.25
144
3.6
0.8
+1
+1
80
90
DD
= +5V and
UNITS
UNITS
mA
mA
µA
µA
V
V
V
V
V
V
CC
=