MAX2247EBC-T Maxim Integrated Products, MAX2247EBC-T Datasheet - Page 2

• Manufacturer Part Number: MAX2247EBC-T
• Description: RF Amplifier 2.4GHz SiGe Linear P ower Amplifier for 8
• Manufacturer: Maxim Integrated Products
• Type: Power Amplifierr

Specifications of MAX2247EBC-T

• Operating Frequency: 2500 MHz
• Supply Current: 345 mA
• Maximum Power Dissipation: 1300 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: UCSP
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 1 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
SHDN, BIAS, PD_OUT ................................-0.3V to V
RF Input Power (50Ω source)...........................................+5dBm
RF_IN Input Current............................................................±1mA
Maximum VSWR Without Damage ........................................10:1
Maximum VSWR for Stable Operation, P
Continuous Power Dissipation (T
Thermal Resistance (Note 1)............................................35°C/W
2.4GHz SiGe Linear Power Amplifier
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX2247 EV kit, V
are at +3V and T
2
Supply Voltage
Supply Current (Notes 4, 5)
Shutdown Supply Current
Digital Input Logic High
Digital Input Logic Low
Digital Input Current High
Digital Input Current Low
CC
4
(derate 28.5mW/°C above +70°C) ..................................1.3W
1, V
_______________________________________________________________________________________
✕
CAUTION! ESD SENSITIVE DEVICE
3 UCSP, 12 WLP
CC
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not recommended.
2, V
PARAMETER
CC
A
B, RF_OUT to GND....................-0.3V to +4.5V
= +25°C, unless otherwise noted.) (Note 3)
CC_
= +2.7V to +4.2V, SHDN = V
A
= +70°C)
Idle current = 250mA
with V
P
Refer to the MAX2247 EV kit for details.
P
Refer to the MAX2247 EV kit for details.
P
Refer to the MAX2247 EV kit for details.
SHDN = 0, no RF signal applied
OUT
OUT
OUT
OUT
CC
= +21dBm with optimized output-matching circuit.
= +18dBm with optimized output-matching circuit.
= +15dBm with optimized output-matching circuit.
< +25dBm........5:1
= 3.3V
CC_
CC
, RF_IN and RF_OUT terminated to 50Ω, T
+ 0.3V
CONDITIONS
P
P
P
OUT
OUT
OUT
= +24dBm, V
= +25dBm, V
= +23dBm, V
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +125°C
UCSP Bump Temperature (soldering) (Note 2)
WLP Bump Soldering Temperature .................................+250°C
Continuous Operating Lifetime.....................10yrs × 0.92
(For Operating Temperature, T
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
CC_
CC_
CC_
= 3.3V
= 4.2V
= 3.0V
MIN
2.7
A
-1
-1
2
A
= -40°C to +85°C. Typical values
≥ +60°C)
TYP
317
345
305
175
120
0.5
85
MAX
350
4.2
0.8
+5
+1
10
UNITS
(T
mA
A
µA
µA
µA
V
V
V
- 60°C)