MAX9996ETP+ Maxim Integrated Products, MAX9996ETP+ Datasheet - Page 10

• Manufacturer Part Number: MAX9996ETP+
• Description: RF Mixer IC MIXER DOWN CONV 1700MHz to 2200MHz
• Manufacturer: Maxim Integrated Products

Specifications of MAX9996ETP+

• Package / Case: TQFN EP
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Table 1. Component List Referring to the Typical Application Circuit
10
Exposed Pad RF/Thermal Considerations
C2, C6, C7, C8, C10, C12
______________________________________________________________________________________
C3, C5, C9, C11
COMPONENT
C13, C14
L1, L2
C15
C1
C4
U1
L3
R1
R2
R3
T1
MAX9996
GND
GND
4:1 balun
V
TAP
VALUE
0.01µF
CC
RF
470nH
150pF
150pF
7.15Ω
10nH
806Ω
549Ω
10pF
22pF
4pF
1
2
3
4
5
20
6
Wire-wound high-Q inductors (0805)
Wire-wound high-Q inductor (0603)
Microwave capacitor (0603)
Microwave capacitor (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitor (0402)
±1% resistor (0603)
±1% resistor (0603)
±1% resistor (1206)
IF balun
Maxim IC
19
7
Pin Configuration/Functional Diagram
18
8
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
17
MAX9996
9
16
10
DESCRIPTION
15
14
13
12
11
GND
GND
V
LO2
LO1
CC
Chip Information