MAX2039ETP+ Maxim Integrated Products, MAX2039ETP+ Datasheet - Page 14

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MAX2039ETP+

Manufacturer Part Number
MAX2039ETP+
Description
RF Mixer IC MIXER UP/DWN HI LIN
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX2039ETP+

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
The EP of the MAX2039’s 20-pin thin QFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the MAX2039 is
mounted be designed to conduct heat from the EP. In
addition, provide the EP with a low-inductance path to
electrical ground. The EP MUST be soldered to a
ground plane on the PC board, either directly or
through an array of plated via holes.
High-Linearity, 1700MHz to 2200MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
14
Exposed Pad RF/Thermal Considerations
______________________________________________________________________________________
RF
C3
C1
C5
C4
C2
V
CC
GND
GND
TAP
V
RF
CC
V
1
2
3
4
5
CC
C6
R1
C9
C7
C8
3
1
MAX2039
V
CC
TRANSISTOR COUNT: 1212
PROCESS: SiGe BiCMOS
T1
LOSEL
INPUT
5
4
15
14
13
Typical Application Circuit
12
11
LO2
V
GND
GND
LO1
IF
CC
C12
C10
C11
Chip Information
V
LO2
INPUT
LO1
INPUT
CC

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