TGL4203-SM TriQuint, TGL4203-SM Datasheet - Page 14

• Manufacturer Part Number: TGL4203-SM
• Description: Active Attenuator DC-30 GHz Analog Atten (17dB)
• Manufacturer: TriQuint

Specifications of TGL4203-SM

• Mounting Style: SMD/SMT
• Package / Case: QFN-16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1028414

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Recommended Surface Mount Package Assembly
Time within 5 °C of Peak Temperature
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Activation Time and Temperature
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Time above Melting Point
Max Peak Temperature
Reflow Profile
Ramp-down Rate
Ramp-up Rate
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
Typical Solder Reflow Profiles
TGL4203-SM
Ordering Information
Part
Assembly Notes
60 – 120 sec @ 140 – 160 °C
July 2009 © Rev A
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
3 °C/sec
SnPb
240 °C
Package Style
3X3 QFN
60 – 180 sec @ 150 – 200 °C
TGL4203-SM
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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