AG602-89G TriQuint, AG602-89G Datasheet - Page 5

• Manufacturer Part Number: AG602-89G
• Description: RF Amplifier DC-3500MHz 14dB Gain@900MHz
• Manufacturer: TriQuint
• Type: Buffer Amplifierr

Specifications of AG602-89G

• Operating Frequency: 0 Hz to 3500 MHz
• P1db: 18.35 dBm at 900 MHz
• Noise Figure: 4.4 dB at 900 MHz
• Operating Supply Voltage: 5.2 V
• Supply Current: 75 mA
• Maximum Operating Temperature: + 177 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-89
• Number Of Channels: 1 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066846

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
AG602-89G (Green / Lead-free SOT-89 Package) Mechanical Information
AG602-89
InGaP HBT Gain Block
A602G
XXXX-X
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Specifications and information are subject to change without notice
The AG602-89G will be marked with an
“A602G” designator with an alphanumeric
lot code marked below the part designator.
The obsolete tin-lead package is marked with
an “AG602” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink.
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
Product Marking
MSL / ESD Rating
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
Ensure that the ground /
Page 5 of 5 July 2008