MMBT3904WT1G ON Semiconductor, MMBT3904WT1G Datasheet - Page 4

• Manufacturer Part Number: MMBT3904WT1G
• Description: TRANS GP SS NPN 40V SOT323
• Manufacturer: ON Semiconductor
• Type: General Purposer

Specifications of MMBT3904WT1G

• Transistor Type: NPN
• Current - Collector (ic) (max): 200mA
• Voltage - Collector Emitter Breakdown (max): 40V
• Vce Saturation (max) @ Ib, Ic: 300mV @ 5mA, 50mA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 100 @ 10mA, 1V
• Power - Max: 150mW
• Frequency - Transition: 300MHz
• Mounting Type: Surface Mount
• Package / Case: SC-70-3, SOT-323-3
• Configuration: Single
• Transistor Polarity: NPN
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 40 V
• Emitter- Base Voltage Vebo: 6 V
• Continuous Collector Current: 0.2 A
• Maximum Dc Collector Current: 0.2 A
• Power Dissipation: 150 mW
• Maximum Operating Frequency: 300 MHz
• Maximum Operating Temperature: + 150 C
• Dc Collector/base Gain Hfe Min: 40 at 0.1 mA at 1 V
• Minimum Operating Temperature: - 55 C
• Current, Collector: 200 mA
• Current, Gain: 30
• Frequency: 300 MHz
• Package Type: SC-70 (SOT-323)
• Polarity: NPN
• Primary Type: Si
• Voltage, Breakdown, Collector To Emitter: 40 V
• Voltage, Collector To Base: 60 V
• Voltage, Collector To Emitter: 40 V
• Voltage, Collector To Emitter, Saturation: 0.3 V
• Voltage, Emitter To Base: 6 V
• Number Of Elements: 1
• Collector-emitter Voltage: 40V
• Collector-base Voltage: 60V
• Emitter-base Voltage: 6V
• Collector Current (dc) (max): 200mA
• Frequency (max): 300MHz
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MMBT3904WT1GOS; MMBT3904WT1GOS; MMBT3904WT1GOSTR

0.05 (0.002)
H
E
A1
1
3
D
e
e1
MMBT3904WT1, NPN MMBT3906WT1, PNP
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
2
A
E
b
0.035
0.025
0.9
0.65
SOLDERING FOOTPRINT*
0.028
A2
PACKAGE DIMENSIONS
0.7
SC−70 (SOT−323)
CASE 419−04
ISSUE M
10
L
0.025
0.65
SCALE 10:1
NOTES:
c
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
0.075
1.9
Y14.5M, 1982.
STYLE 3:
DIM
H
A1
A2
e1
A
b
c
D
E
e
L
PIN 1. BASE
E
2. EMITTER
3. COLLECTOR
inches
0.80
0.00
0.30
0.10
1.80
1.15
1.20
2.00
MIN
mm
MILLIMETERS
0.425 REF
0.65 BSC
0.7 REF
NOM
0.90
0.05
0.35
0.18
2.10
1.24
1.30
2.10
MAX
1.00
0.10
0.40
0.25
2.20
1.35
1.40
2.40
0.032
0.000
0.012
0.004
0.071
0.045
0.047
0.079
MIN
0.026 BSC
0.017 REF
0.028 REF
INCHES
0.035
0.002
0.014
0.007
0.083
0.049
0.051
0.083
NOM
0.040
0.004
0.016
0.010
0.087
0.053
0.055
0.095
MAX