MASW-003103-13640G M/A-Com Technology Solutions, MASW-003103-13640G Datasheet
MASW-003103-13640G
Related parts for MASW-003103-13640G
MASW-003103-13640G Summary of contents
Page 1
... J4 2. The exposed pad centered on the chip bottom must be con- nected to RF and DC ground. Ordering Information Part Number MASW-003103-13640G MASW-003103-13640P 3. Reference Application Note M513 for reel size information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • ...
Page 2
... MASW-003103-1364 HMIC Silicon PIN Diode SP3T Switch TM 50 MHz - 20 GHz Electrical Specifications: T Parameter Insertion Loss Isolation Input Return Loss Output to Output Isolation 4 Switching Speed 5 Voltage Rating Input 0.1dB Compression Point 4. Typical Switching Speed measured fro 10 detected RF signal driven by TTL compatible drivers. ...
Page 3
... M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Iso la tio ( ( MASW -003103-1364 Maximum Input Power Curve Baseplate Temperature fixed @ 25degC 2GHz, 5. 10GHz, 2.75W 2 22GHz 0.2 0.4 0.6 0.8 1 1.2 1.4 Insertion Loss (dB) Rev. V6P 1.6 ...
Page 4
... MHz - 20 GHz Bias Control Optimal operation of the MASW-003103-1364 is achieved by simultaneous application of negative DC voltage and current to the low loss switching arm J2, J3, or J4, and positive DC voltage and current to the remaining switching arms as shown in the applications circuit below. DC return is achieved via R2 on the J1/RF Com Path. ...
Page 5
... Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Side View 125 J4 J4 285 200 Units in µm Ground radius is 200um centered on the I/O Pad. MASW-003103-1364 Inches MIN MAX 0.06417 0.06614 0.08031 0.08228 0.00394 0.00591 • ...
Page 6
... MASW-003103-1364 HMIC Silicon PIN Diode SP3T Switch TM 50 MHz - 20 GHz Handling Procedures Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ≤ ...
Page 7
... MASW-003103-1364 HMIC Silicon PIN Diode SP3T Switch TM 50 MHz - 20 GHz Pocket Tape Information +.012 +0.30 8.00 - 0.10 .093 ± .002 2.36 ± 0.05 .012 ± .002 0.30 ± 0.05 POCKET DEPTH 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development ...
Page 8
... MASW-003103-1364 HMIC Silicon PIN Diode SP3T Switch TM 50 MHz - 20 GHz A DIM ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development ...