NSTB60BDW1T1 ON Semiconductor, NSTB60BDW1T1 Datasheet

TRANS BRT PNP/NPN 50V GP SOT363

NSTB60BDW1T1

Manufacturer Part Number
NSTB60BDW1T1
Description
TRANS BRT PNP/NPN 50V GP SOT363
Manufacturer
ON Semiconductor
Datasheet

Specifications of NSTB60BDW1T1

Transistor Type
1 NPN Pre-Biased, 1 PNP
Current - Collector (ic) (max)
150mA
Voltage - Collector Emitter Breakdown (max)
50V
Resistor - Base (r1) (ohms)
22K
Resistor - Emitter Base (r2) (ohms)
47K
Dc Current Gain (hfe) (min) @ Ic, Vce
80 @ 5mA, 10V / 120 @ 5mA, 10V
Vce Saturation (max) @ Ib, Ic
250mV @ 5mA, 10mA / 500mV @ 5mA, 50mA
Current - Collector Cutoff (max)
500nA
Frequency - Transition
140MHz
Power - Max
250mW
Mounting Type
Surface Mount
Package / Case
SC-70-6, SC-88, SOT-363
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NSTB60BDW1T1OS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NSTB60BDW1T1
Manufacturer:
ON Semiconductor
Quantity:
2 200
1. FR–4 @ Minimum Pad
2. FR–4 @ 1.0 x 1.0 inch Pad
MAXIMUM RATINGS
(T
June, 2002 – Rev. 2
THERMAL CHARACTERISTICS
A
Collector-Emitter Voltage
Collector-Base Voltage
Emitter–Base Voltage
Collector Current – Continuous
Total Device Dissipation
Derate above 25 C
Thermal Resistance –
Total Device Dissipation
Derate above 25 C
Thermal Resistance –
Thermal Resistance –
Junction and Storage Temperature
ESD Rating
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 8 mm, 7 inch/3000 Unit Tape and Reel
ESD Rating – Human Body Model: Class 1B
Semiconductor Components Industries, LLC, 2002
= 25 C unless otherwise noted, common for Q
T
Junction-to-Ambient
T
Junction-to-Ambient
Junction-to-Lead
A
A
(Both Junctions Heated)
(One Junction Heated)
= 25 C
= 25 C
Characteristic
Characteristic
Rating
– Machine Model: Class B
Symbol
Symbol
Symbol
T
V
V
V
R
R
R
J
P
P
CEO
CBO
, T
EBO
I
C
D
D
JA
JA
JL
stg
1
–150
–6.0
187 (Note 1)
256 (Note 2)
670 (Note 1)
490 (Note 2)
250 (Note 1)
385 (Note 2)
493 (Note 1)
325 (Note 2)
188 (Note 1)
208 (Note 2)
–50
–50
1.5 (Note 1)
2.0 (Note 2)
2.0 (Note 1)
3.0 (Note 2)
–55 to +150
and Q
Q
1
Max
Max
2
)
150
5.0
Q
50
50
2
mW/ C
mW/ C
1
mAdc
Unit
Unit
Unit
Vdc
Vdc
Vdc
mW
mW
C/W
C/W
C/W
C
ORDERING INFORMATION
NSTB60BDW1T1
Device
(3)
Q
(4)
2
71 = Specific Device Code
d
MARKING DIAGRAM
http://onsemi.com
= Date Code
R
2
6
CASE 419B
SOT–363
SOT–363
Package
STYLE 1
5
(5)
4
71
Publication Order Number:
R
(2)
d
1
1
2
NSTB60BDW1T1/D
3
3000/Tape & Reel
Shipping
Q
(1)
(6)
1

Related parts for NSTB60BDW1T1

NSTB60BDW1T1 Summary of contents

Page 1

... C/W JL 208 (Note –55 to +150 C stg 1 http://onsemi.com (3) (2) ( (4) (5) ( SOT–363 CASE 419B STYLE 1 MARKING DIAGRAM Specific Device Code d = Date Code ORDERING INFORMATION Device Package Shipping NSTB60BDW1T1 SOT–363 3000/Tape & Reel Publication Order Number: NSTB60BDW1T1/D ...

Page 2

... Collector-Emitter Saturation Voltage ( mA 5.0 mA) (Note Current Gain ( 5.0 mA) (Note Output Voltage ( Output Voltage (off 5 0. Input Resistor (Note 3) Resistor Ratio (Note 3) 3. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0% NSTB60BDW1T1 ( unless otherwise noted) A Symbol = (BR)CBO V (BR)CEO = (BR)EBO = CBO = EBO V ...

Page 3

... Typical Electrical Characteristics – PNP Transistor Figure 1. Normalized DC Current Gain Figure 3. Current–Gain – Bandwidth Product Figure 5. Output Admittance NSTB60BDW1T1 Figure 2. “Saturation” and “On” Voltages Figure 4. Capacitances Figure 6. Base Spreading Resistance http://onsemi.com 3 ...

Page 4

... B 0.1 0. COLLECTOR CURRENT (mA) C Figure 7. Maximum Collector Voltage versus Collector Current 4 3.5 3 2.5 2 1 REVERSE BIAS VOLTAGE (V) R Figure 9. Output Capacitance 100 10 1 0.1 0 Figure 11. Input Voltage versus Output Current NSTB60BDW1T1 1000 – 100 100 MHz 0.1 0. Figure 10. Output Current versus Input T = – ...

Page 5

... Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. NSTB60BDW1T1 interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. ...

Page 6

... This profile shows temperature versus time. NSTB60BDW1T1 SOLDER STENCIL GUIDELINES The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i ...

Page 7

... PACKAGE DIMENSIONS –B– NSTB60BDW1T1 SOT–363 CASE 419B–02 ISSUE http://onsemi.com 7 ...

Page 8

... N. American Technical Support: 800–282–9855 Toll Free USA/Canada NSTB60BDW1T1 JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 8 NSTB60BDW1T1/D ...

Related keywords