TNPW04021K50BEED Vishay, TNPW04021K50BEED Datasheet - Page 9

• Manufacturer Part Number: TNPW04021K50BEED
• Description: Res Thin Film 0402 1.5K Ohm 0.1% 1/16W ±25ppm/°C Molded SMD Paper T/R
• Manufacturer: Vishay
• Type: Thin Filmr
• Series: TNPWr

Specifications of TNPW04021K50BEED

• Case Size: 0402
• Resistance Value: 1.5 KOhm
• Power Rating: 1/16 W
• Tolerance: 0.1 %
• Resistance (ohms): 1.5K
• Power (watts): 0.063W, 1/16W
• Composition: Thin Film
• Temperature Coefficient: ±25ppm/°C
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height: 0.014" (0.35mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 0402 (1005 Metric)
• Resistance In Ohms: 1.50K
• Case: 0402 (1005 metric)
• Power Rating(s): 1/16W
• Resistance: 1.5kohm
• Tolerance (+ Or -): 0.1%
• Mounting Style: Surface Mount
• Operating Temp Range: -55C to 125C
• Case Style: Molded
• Military Standard: Not Required
• Failure Rate: Not Required
• Product Length (mm): 1mm
• Product Depth (mm): 0.5mm
• Product Height (mm): 0.35mm
• Voltage Rating: 50 Volts
• Operating Temperature Range: + 155 C
• Termination Style: SMD/SMT
• Dimensions: 0.5 mm W x 1 mm L x 0.35 mm H
• Product: Precision Resistors Thin Film SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Details
• Other names: TNP1.50KDATR; TNPW0402 1K5 0.1% T9 ET7 E3; TNPW04021K50BEED

Document Number: 28758
Revision: 30-Sep-08
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
4.17.2
4.18.2
4.29
4.32
4.33
4.7
4.35
APPLICABLE SPECIFICATIONS
• CECC40000/40400
• EN140400
• EN 140401-801
• EN 60115-1
• IEC 60286-3
-
TEST METHOD
IEC 60068-2
21 (Ue
21 (Ue
45 (XA)
58 (Td)
58 (Td)
-
-
-
3
1
)
)
soldering heat
Resistance to
Voltage proof
Flammability
For technical questions, contact: [e-mail]
Solderability
Component
Damp heat
(adhesion)
resistance
Substrate
bending
solvent
Shear
TEST
High Stability Thin Film Flat Chip Resistor
≤ 0.05 % (1000 h rated power at 70 °C)
Stability for product types:
RR 1005M and RR 1608M;
RR 2012M and RR 3216M:
SnPb40; non-activated flux
Isopropyl alcohol + 50 °C;
SnAg3Cu0.5 or SnAg3.5;
(215 ± 3) °C; (3 ± 0.3) s
(235 ± 3) °C; (2 ± 0.2) s
(260 ± 5) °C; (10 ± 1) s
needle flame test; 10 s
Depth 2 mm, 3 times
Solder bath method;
Solder bath method;
Solder bath method;
U
(85 ± 5) °C; 56 days
non-activated flux
rms
IEC 60695-11-5,
PROCEDURE
(85 ± 5) % RH
= U
method 2
45 N
9 N
ins
; 60 ± 5 s
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
no visible damage, no open circuit in bent position
Good tinning (≥ 95 % covered);
No flashover or breakdown
PERMISSIBLE CHANGE
± (0.02 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
No burning after 30 s
± (0.25 R + 0.05 Ω)
No visible damage
No visible damage
REQUIREMENTS
no visible damage
TNPW e3
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