XC3S1200E-4FT256C Xilinx Inc, XC3S1200E-4FT256C Datasheet - Page 171

• Manufacturer Part Number: XC3S1200E-4FT256C
• Description: FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
• Manufacturer: Xilinx Inc

Specifications of XC3S1200E-4FT256C

• Package: 256FTBGA
• Family Name: Spartan®-3E
• Device Logic Cells: 19512
• Device Logic Units: 2168
• Device System Gates: 1200000
• Number Of Registers: 17344
• Maximum Internal Frequency: 572 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 190
• Ram Bits: 516096

User I/Os by Bank
Table 132
distributed between the four I/O banks on the VQ100 pack-
age.
Table 132: User I/Os Per Bank for XC3S100E, XC3S250E, and XC3S500E in the VQ100 Package
Footprint Migration Differences
The production XC3S100E, XC3S250E, and XC3S500E
FPGAs have identical footprints in the VQ100 package.
Designs can migrate between the devices without further
consideration.
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Edge
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
indicates how the 66 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
I/O
15
15
19
17
66
I/O
16
5
6
0
5
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INPUT
0
0
0
1
1
All Possible I/O Pins by Type
DUAL
18
21
1
0
2
VREF
1
1
1
1
4
(1)
Pinout Descriptions
CLK
0
24
8
8
8
(2)
(1)
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