CC109130507 Lineage Power, CC109130507 Datasheet - Page 22

• Manufacturer Part Number: CC109130507
• Description: Module DC-DC 1-OUT 0.6V to 3.63V 20A 10-Pin SMT T/R
• Manufacturer: Lineage Power

Data Sheet
April 7, 2011
Surface Mount Information
Pick and Place
The TLynx
and are designed for a fully automated assembly
process. The modules are fitted with a label designed
to provide a large surface area for pick and place
operations. The label meets all the requirements for
surface mount processing, as well as safety standards,
and is able to withstand reflow temperatures of up to
300
as product code, serial number and the location of
manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Lead Free Soldering
The TLynx
RoHS compliant and fully compatible in a Pb-free
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 42. Soldering outside of the
recommended profile requires testing to verify results
and performance.
MSL Rating
The TLynx
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
LINEAGE
o
C. The label also carries product information such
POWER
TM
TM
TM
modules use an open frame construction
modules are lead-free (Pb-free) and
modules have a MSL rating of 2.
2.4 – 5.5Vdc input; 0.6Vdc to 3.63Vdc output; 20A output current
TLynx
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Figure 47. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to the Board Mounted Power Modules: Soldering
and Cleaning Application Note (AN04-001).
TM
: Non-isolated DC-DC Power Modules:
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
22