108979519 Lineage Power, 108979519 Datasheet - Page 20

• Manufacturer Part Number: 108979519
• Description: Module DC-DC 1-OUT 0.75V to 3.63V 16A 6-Pin SMT T/R
• Manufacturer: Lineage Power
• Type: Non-Inverting|Inverting|Step Up|Step Downr

Specifications of 108979519

• Package: 6SMT
• Output Current: 16 A
• Output Voltage: 0.75 to 3.63 V
• Input Voltage: 3 to 5.5 V
• Number Of Outputs: 1
• Switching Regulator: Yes

Data Sheet
October 2, 2009
Surface Mount Information
Lead Free Soldering
The –Z version Austin SuperLynx SMT modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices)
for both Pb-free solder profiles and MSL
classification procedures. This standard provides a
recommended forced-air-convection reflow profile
based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is
Sn/Ag/Cu (SAC). The recommended linear reflow
profile using Sn/Ag/Cu solder is shown in Fig. 37.
MSL Rating
The
rating of 1.
Storage and Handling
The recommended storage environment and
handling procedures for moisture-sensitive surface
mount packages is detailed in J-STD-033 Rev. A
(Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
LINEAGE
Austin SuperLynx SMT
POWER
modules have a MSL
3.0 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 16A output current
(continued)
Austin Superlynx
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of ≤ 30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed
SMT packages will be a minimum of 12 months
from the bag seal date, when stored at the
following conditions: < 40° C, < 90% relative
humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
Figure 37. Recommended linear reflow profile
using Sn/Ag/Cu solder.
300
250
200
150
100
50
0
TM
Per J-STD-020 Rev. C
Heating Zone
SMT Non-isolated Power Modules:
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
20