108975459 Lineage Power, 108975459 Datasheet - Page 11

• Manufacturer Part Number: 108975459
• Description: Module DC-DC 1-OUT 5V 6.6A 6-Pin SMT Tray
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of 108975459

• Package: 6SMT
• Output Current: 6.6 A
• Output Voltage: 5 V
• Input Voltage: 24 V
• Number Of Outputs: 1

Data Sheet
October 5, 2009
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, T
specifications is shown in Figure 18. For reliable
operation this temperature should not exceed 110
Figure 18. T
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (T
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section.
EMC Considerations
The figure 19 shows a suggested configuration to meet
the conducted emission limits of EN55022 Class B.
LINEAGE
Tref
POWER
ref
Temperature Measurement Location.
Airflow
ref
used in the
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
A
) for natural
o
C
Figure 19. Suggested Configuration for EN55022
Class B.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
The HC power module series are low profile in order to
be used in fine pitch system card architectures. As
such, component clearance between the bottom of the
power module and the mounting board is limited. Avoid
placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
For additional layout guide-lines, refer to FLTR100V10
data sheet.
HC006/010 Series DC-DC Power Module:
11