108975053 Lineage Power, 108975053 Datasheet - Page 19

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108975053

Manufacturer Part Number
108975053
Description
Module DC-DC 1-OUT 0.8V to 5.5V 25A 11-Pin SMT
Manufacturer
Lineage Power
Type
Step Downr
Datasheet

Specifications of 108975053

Package
11SMT
Output Current
25 A
Output Voltage
0.8 to 5.5 V
Input Voltage
12 V
Number Of Outputs
1

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
108975053+
Quantity:
168
Data Sheet
May 19, 2009
Surface Mount Information
Reflow Soldering Information
These NXA025series power modules are large mass,
low thermal resistance devices and typically heat up
slower than other SMT components. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
These surface mountable modules use our newest
SMT technology called “Column Pin” (CP) connectors.
Fig 32 shows the new CP connector before and after
reflow soldering onto the end-board assembly.
Figure 32. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is
able to compensate for large amounts of co-planarity
and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
LINEAGE
POWER
Solder Ball
Insulator
NXA Board
End assembly PCB
10 – 14Vdc Input; 0.8Vdc to 5.5Vdc Output; 25A output current
(continued)
o
C, wets the
Naos
TM
NXA025 SMT Non-isolated Power Modules:
Figure 32. Recommended Reflow Profile.
Figure 33. Time Limit Curve Above 205
300
200
240
235
230
225
220
205
200
250
100
215
210
150
50
0
0
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
TIME LIMIT (S)
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
o
above
C
o
Co o ling
zo ne
1 -4
C Reflow.
50
o
Cs
-1
19
60

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