CC109101301 Lineage Power, CC109101301 Datasheet - Page 18

• Manufacturer Part Number: CC109101301
• Description: Module DC-DC 1-OUT 0.75V to 3.63V 3A 5-Pin SMT T/R
• Manufacturer: Lineage Power

Data Sheet
October 2, 2009
Surface Mount Information
Pick and Place
The Austin MiniLynx
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and placing. The label meets all the
requirements for surface mount processing, as well as
safety standards and is able to withstand maximum
reflow temperature. The label also carries product
information such as product code, serial number and
location of manufacture.
Figure 36. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MiniLynx
free modules and can be soldered either in a lead-free
solder process or a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The Austin MiniLynx
free modules and can be soldered either in a lead-free
solder process or a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
LINEAGE
POWER
TM
TM
TM
SMT modules use an open
SMT power modules are lead
SMT power modules are lead
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 3A output current
Austin MiniLynx
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Figure 37. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 38. Time Limit Curve Above 205
for Tin Lead (Sn/Pb) process.
300
200
240
235
230
225
220
205
200
250
100
215
210
150
50
0
TM
0
SMT Non-isolated Power Modules:
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
o
above
C
o
Co o ling
zo ne
1 -4
C Reflow
50
o
Cs
-1
18
60