MT48LC4M16A2P-7E:G Micron Technology Inc, MT48LC4M16A2P-7E:G Datasheet - Page 53

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MT48LC4M16A2P-7E:G

Manufacturer Part Number
MT48LC4M16A2P-7E:G
Description
DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Datasheet

Specifications of MT48LC4M16A2P-7E:G

Density
64 Mb
Maximum Clock Rate
143 MHz
Package
54TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
5.4 ns
Operating Temperature
0 to 70 °C
Organization
4Mx16
Address Bus
14b
Access Time (max)
5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (4M x 16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-TSOP (0.400", 10.16mm Width)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC4M16A2P-7E:G
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 36:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
DQML, DQMH
Power-Down Mode
COMMAND
A0–A9, A11
Precharge all
DQM /
BA0, BA1
active banks
Notes:
CLK
CKE
A10
DQ
High-Z
t CKS
t CMS
t AS
SINGLE BANK
PRECHARGE
ALL BANKS
BANK(S)
1. Violating refresh requirements during power-down may result in a loss of data.
T0
t CMH
t CKH
t AH
Two clock cycles
All banks idle, enter
power-down mode
t CK
T1
NOP
t CKS
t CL
T2
NOP
Input buffers gated off while in
power-down mode
t CH
53
Exit power-down mode
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
t CKS
Tn + 1
NOP
All banks idle
64Mb: x4, x8, x16 SDRAM
©2000 Micron Technology, Inc. All rights reserved.
Tn + 2
ACTIVE
ROW
ROW
BANK
DON’T CARE
Timing Diagrams

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