MT48LC4M16A2P-6:G Micron Technology Inc, MT48LC4M16A2P-6:G Datasheet - Page 72

• Manufacturer Part Number: MT48LC4M16A2P-6:G
• Description: DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC4M16A2P-6:G

• Density: 64 Mb
• Maximum Clock Rate: 166 MHz
• Package: 54TSOP-II
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 5.5 ns
• Operating Temperature: 0 to 70 °C
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 64M (4M x 16)
• Speed: 167MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 54-TSOP II
• Organization: 4Mx16
• Address Bus: 14b
• Access Time (max): 5.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 180mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 55:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
54X Ø0.45 ±0.05
SEATING PLANE
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
6.40
54-Ball VFBGA “F4/B4” Package, 8mm x 8mm
0.10 C
BALL A9
3.20
Notes:
0.65 ±0.05
C
1. All dimensions in millimeters.
2. Recommended pad = Ø 0.40mm SMD.
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All other trademarks are the property of their respective owners.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
0.80 TYP
C L
BALL A1
BALL A1 ID
72
4.00 ±0.05
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER MASK DEFINED BALL PADS:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.40
64Mb: x4, x8, x16 SDRAM
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.
BALL A1 ID