MT48LC32M16A2TG-75:C Micron Technology Inc, MT48LC32M16A2TG-75:C Datasheet - Page 26

• Manufacturer Part Number: MT48LC32M16A2TG-75:C
• Description: DRAM Chip SDRAM 512M-Bit 32Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC32M16A2TG-75:C

• Density: 512 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: 0 to 70 °C
• Organization: 32Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 115mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Figure 15:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
READ-to-PRECHARGE
each possible CL; data element n + 3 is either the last of a burst of four or the last desired
of a longer burst. Following the PRECHARGE command, a subsequent command to the
same bank cannot be issued until
hidden during the access of the last data element(s).
In the case of a fixed-length burst being executed to completion, a PRECHARGE
command issued at the optimum time (as described above) provides the same operation
that would result from the same fixed-length burst with auto precharge. The disadvan-
tage of the PRECHARGE command is that it requires that the command and address
buses be available at the appropriate time to issue the command; the advantage of the
PRECHARGE command is that it can be used to truncate fixed-length or full-page bursts.
Full-page READ bursts can be truncated with the BURST TERMINATE command, and
fixed-length READ bursts may be truncated with a BURST TERMINATE command,
provided that auto precharge was not activated. The BURST TERMINATE command
should be issued x cycles before the clock edge at which the last desired data element is
valid, where x = CL - 1. This is shown in Figure 16 on page 27 for each possible CL; data
element n + 3 is the last desired data element of a longer burst.
COMMAND
COMMAND
NOTE: DQM is LOW.
ADDRESS
ADDRESS
CLK
CLK
DQ
DQ
BANK a,
BANK a,
COL n
COL n
T0
T0
READ
READ
CAS Latency = 2
CAS Latency = 3
T1
T1
NOP
NOP
26
T2
T2
NOP
NOP
D
t
OUT
n
RP is met. Note that part of the row precharge time is
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T3
T3
TRANSITIONING DATA
NOP
NOP
n + 1
D
D
OUT
OUT
n
PRECHARGE
PRECHARGE
(a or all)
(a or all)
T4
BANK
BANK
T4
X = 1 cycle
n + 2
D
n + 1
D
OUT
OUT
512Mb: x4, x8, x16 SDRAM
X = 2 cycles
T5
T5
NOP
NOP
n + 2
n + 3
D
D
OUT
OUT
t RP
t RP
©2000 Micron Technology, Inc. All rights reserved.
T6
T6
NOP
NOP
n + 3
D
OUT
DON’T CARE
Operations
BANK a,
BANK a,
ACTIVE
ACTIVE
T7
T7
ROW
ROW