MT48LC2M32B2P-6 IT:G TR Micron Technology Inc, MT48LC2M32B2P-6 IT:G TR Datasheet - Page 33

• Manufacturer Part Number: MT48LC2M32B2P-6 IT:G TR
• Description: DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II T/R
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC2M32B2P-6 IT:G TR

• Package: 86TSOP-II
• Density: 64 Mb
• Address Bus Width: 13 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Clock Rate: 166 MHz
• Maximum Random Access Time: 17|7.5|5.5 ns
• Operating Temperature: -40 to 85 °C
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 64M (2Mx32)
• Speed: 167MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 86-TSOP
• Organization: 2Mx32
• Address Bus: 13b
• Access Time (max): 17/7.5/5.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 180mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Power-Down
Figure 22:
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
Terminating a WRITE Burst
Note:
Power-down occurs if CKE is registered LOW coincident with a NOP or COMMAND
INHIBIT when no accesses are in progress (see Figure 24 on page 34). If power-down
occurs when all banks are idle, this mode is referred to as precharge power-down; if
power-down occurs when there is a row active in either bank, this mode is referred to as
active power-down. Entering power-down deactivates the input and output buffers,
excluding CKE, for maximum power savings while in standby. The device may not
remain in the power-down state longer than the refresh period (
refresh operations are performed in this mode.
The power-down state is exited by registering an NOP or COMMAND INHIBIT and CKE
HIGH at the desired clock edge (meeting
COMMAND
ADDRESS
DQMs are LOW.
CLK
DQ
BANK,
WRITE
COL n
D
T0
n
IN
TERMINATE
BURST
T1
DON’T CARE
COMMAND
(ADDRESS)
(DATA)
T2
NEXT
33
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
CKS).
©2001 Micron Technology, Inc. All rights reserved.
t
64Mb: x32 SDRAM
REF or
t
REF
Commands
AT
) since no