MT48LC16M16A2FG-7E:D Micron Technology Inc, MT48LC16M16A2FG-7E:D Datasheet - Page 18

DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin VFBGA Tray

MT48LC16M16A2FG-7E:D

Manufacturer Part Number
MT48LC16M16A2FG-7E:D
Description
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr

Specifications of MT48LC16M16A2FG-7E:D

Package
54VFBGA
Density
256 Mb
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Clock Rate
143 MHz
Maximum Random Access Time
5.4 ns
Operating Temperature
0 to 70 °C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (16Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-VFBGA
Organization
16Mx16
Address Bus
15b
Access Time (max)
5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC16M16A2FG-7E:D
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48LC16M16A2FG-7E:D TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48LC16M16A2FG-7E:DTR
Manufacturer:
HYNIX
Quantity:
75
Figure 9: 54-Ball VFBGA "FG" (8mm x 14mm) (x16)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
SEATING PLANE
54X Ø0.45
6.40
0.10 C
3.20 ±0.05
BALL A9
Notes:
C
0.65 ±0.05
3.20 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.065mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
0.80 TYP
BALL A1
0.80 TYP
7.00 ±0.05
BALL A1 ID
18
14.00 ±0.10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.00 MAX
256Mb: x4, x8, x16 SDRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø 0.40
Package Dimensions
© 1999 Micron Technology, Inc. All rights reserved.
BALL A1 ID

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