MT46V32M16FN-6:F TR Micron Technology Inc, MT46V32M16FN-6:F TR Datasheet - Page 79

• Manufacturer Part Number: MT46V32M16FN-6:F TR
• Description: DRAM Chip DDR SDRAM 512M-Bit 32Mx16 2.5V 60-Pin FBGA T/R
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46V32M16FN-6:F TR

• Package: 60FBGA
• Density: 512 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 2.5 V
• Maximum Clock Rate: 333 MHz
• Maximum Random Access Time: 0.7 ns
• Operating Temperature: 0 to 70 °C
• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 6ns
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 2.7 V
• Package / Case: 60-FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Figure 44:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 512Mb DDR: Rev. N; Core DDR Rev. B 2/09 EN
Command
t DQSS (NOM)
t DQSS (MIN)
t DQSS (MAX)
Address
DQS
DQS
DQS
CK#
DM
DM
DM
DQ
DQ
DQ
CK
WRITE-to-READ – Odd Number of Data, Interrupting
Notes:
Bank a,
WRITE
Col b
T0
t DQSS
t DQSS
t DQSS
1. DI b = data-in for column b; DO n = data-out for column n.
2. An interrupted burst of 4 is shown; one data element is written.
3.
4. A10 is LOW with the WRITE command (auto precharge is disabled).
5. DQS is required at T1n, T2, and T2n (nominal case) to register DM.
6. If the burst of 8 is used, DM and DQS are required at T3–T3n because the READ command
t
the last two data elements).
will not mask these data elements.
DI
b
WTR is referenced from the first positive CK edge after the last desired data-in pair (not
NOP
DI
T1
b
DI
b
T1n
NOP
T2
t WTR
T2n
79
Bank a,
READ
Col n
T3
T3n
Micron Technology, Inc., reserves the right to change products or specifications without notice.
CL = 2
CL = 2
CL = 2
NOP
T4
512Mb: x4, x8, x16 DDR SDRAM
Transitioning Data
T5
NOP
©2000 Micron Technology, Inc. All rights reserved.
DO
DO
DO
n
n
n
T5n
T6
NOP
Operations
Don’t Care
T6n