460150403 Molex Inc, 460150403 Datasheet - Page 4

• Manufacturer Part Number: 460150403
• Manufacturer: Molex Inc
• Type: Wire to Boardr

Specifications of 460150403

• Pitch: 4.2 mm
• Number Of Rows: 2
• Number Of Contacts: 4
• Gender: HDR
• Termination Method: Solder

REVISION:
DOCUMENT NUMBER:
5.0 WIRE-TO-WIRE PERFORMANCE
B4
4.4 TEMPERATURE RATINGS
4.5 WAVE SOLDER PROCESS TEMPERATURE
4.6 MATING CYCLES
5.1 ELECTRICAL REQUIREMENTS
ITEM
PS-45750-001
1
2
3
4
Operating:
Nonoperating: - 40° C to + 105° C
Headers with molded pegs: 240° C MAX.
Headers without pegs: 260° C MAX.
Tin:
Gold: 100 cycles
ECR/ECN INFORMATION:
EC No:
(via Current Cycling)
DATE:
Temperature Rise
Withstanding
(Low Level)
Resistance
Resistance
Insulation
Dielectric
Contact
Voltage
UCP2009-0064
2008 / 07 / 08
30 cycles
TEST
- 40° C to + 105° C (includes 30° C tempe rature rise from applied current)
PRODUCT SPECIFICATION
EIA-364-20: Apply a voltage of 1500 VAC for
1 minute between adjacent contacts.
Mate connectors. Measure the temperature
rise at the rated current after 96 hours,
during current cycling (45 minutes ON and
15 minutes OFF per hour) for 240 hours, and
after final 96-hour steady state.
EIA-364-23: Mate connectors; apply a
maximum voltage of 20 mV and a current of
100 mA. Wire resistance shall be removed
from the measured value.
Mate connectors: apply a voltage of 500
VDC between adjacent terminals and
between terminals to ground.
TITLE:
CREATED / REVISED BY:
BWIRKUS
TEST PROCEDURE
PRODUCT SPECIFICATION FOR
CONNECTOR SYSTEM
MINI-FIT PLUS HCS
CHECKED BY:
APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
requirement for test sequence.
Measurement following test
Initial measurement: None.
Current leakage < 5 mA
criteria: As specified in
+30° C MAXIMUM
Temperature rise:
REQUIREMENT
1000 Megohms
No breakdown.
MINIMUM
APPROVED BY:
APATEL
SHEET No.
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