1-146134-9 Tyco Electronics, 1-146134-9 Datasheet - Page 67

Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST SMD

1-146134-9

Manufacturer Part Number
1-146134-9
Description
Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST SMD
Manufacturer
Tyco Electronics
Type
Unshrouded Headerr
Series
AMPMODU® Mod IIr
Datasheets

Specifications of 1-146134-9

Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
16
Gender
HDR
Contact Plating
Tin Over Nickel
Termination Method
Solder
Contact Type
Male Pin
Connector Type
Header, Unshrouded, Breakaway
Number Of Positions
16
Number Of Positions Loaded
All
Row Spacing
0.100" (2.54mm)
Contact Mating Length
0.230" (5.84mm)
Mounting Type
Surface Mount
Termination
Solder
Contact Finish
Tin
Contact Finish Thickness
100µin (2.54µm)
Color
Black
Product Type
Headers - Breakaway
Number Of Positions / Contacts
16
Mounting Style
SMD/SMT
Mounting Angle
Vertical
Housing Material
Thermoplastic, Glass Filled
Contact Material
Phosphor Bronze
Current Rating
3 A
Operating Temperature Range
- 65 C to + 125 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Fastening Type
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PC Board Thickness
ACTION PIN posts are
designed for use in a variety
of PC board thicknesses.
However, certain ACTION
PIN posts are to be used in
specific ranges of board
thicknesses. To promote
optimum
performance, the
recommended board
thicknesses provided with
the connector being used
must be followed.
ACTION PIN Post/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
**Radial hole distortion.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
ACTION PIN Contact
Material Thickness
.025 [0.64]
.0453
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
Drilled Hole
Diameter
±.001
[1.151
AMPMODU Interconnection System
ACTION PIN Press-Fit Posts
ACTION PIN posts provide a more reliable press-fit
connection. Localized pressure in the interface area provides
oxide break-through and prevents corrosion better in many
of the harshest environments to help provide a reliable
connection. Also, radial and axial distortion are controlled to
meet today’s standards for multilayer board applications.
±0.03
]
.001-.003 [0.03-0.08] .0003 [0.008]Min.
Copper
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Plating Thicknesses
*
Tin-lead
(Continued)
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
.037-.043 [0.94-1.09]
Plated-Through
Hole Diameter
➀ Annular Ring (See Note)
➁ Drilled Hole
➂ Copper Thickness
➃ Tin-lead Thickness
➄ Plated-Through Hole
.0015 [0.038]
Average
Distortion Specification*
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
Maximum
.002 [0.05]
151
5

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