L77HDE15S Amphenol, L77HDE15S Datasheet - Page 99

• Manufacturer Part Number: L77HDE15S
• Description: Conn High Density D-Sub SKT 15 POS Solder Cup ST Panel Mount 15 Terminal 1 Port
• Manufacturer: Amphenol
• Type: High Density D-Subr

Specifications of L77HDE15S

• Gender: SKT
• Termination Method: Solder Cup
• Mounting: Panel Mount
• Body Orientation: Straight

Amphenol InfoCom Europe | www.amphenolinfocom.eu | [e-mail] | Specifications subject to change
Miniature Card –SiM + MiCro-Sd CoMbo ConneCtor
Part Numbers:
101-00269-64
101-00269-68
101-00269-69
101-00270-64
101-00270-68
101-00270-69
101-00271-64
101-00271-68
101-00271-69
101-00272-64
101-00272-68
101-00272-69
101-00306-64
101-00306-68
101-00306-69
101-00309-64
101-00309-68
101-00309-69
101-00364-64
101-00364-68
101-00364-69
101-00365-64
101-00365-68
101-00365-69
P/n
P/n
SIM 6P p-p, Normal Type, w/o C/D, 1 u “ Au plated
SIM 6P p-p, Normal Type, w/o C/D, 15 u “ Au plated
SIM 6P p-p, Normal Type, w/o C/D, 30 u “ Au plated
SIM 6P p-p, Reverse Type, w/o C/D, 1 u “ Au plated
SIM 6P p-p, Reverse Type, w/o C/D, 15 u “ Au plated
SIM 6P p-p, Reverse Type, w/o C/D, 30 u “ Au plated
SIM 8P p-p, Normal Type, w/ C/D, 1 u “ Au plated
SIM 8P p-p, Normal Type, w/ C/D, 15 u “ Au plated
SIM 8P p-p, Normal Type, w/ C/D, 30 u “ Au plated
SIM 8P p-p, Reverse Type, w/ C/D, 1 u “ Au plated
SIM 8P p-p, Reverse Type, w/ C/D, 15 u “ Au plated
SIM 8P p-p, Reverse Type, w/ C/D, 30 u “ Au plated
SIM 8P p-p, Reverse Type, w/ C/D , 1 u “ Au plated
SIM 8P p-p, Reverse Type, w/ C/D , 15 u “ Au plated
SIM 8P p-p, Reverse Type, w/ C/D , 30 u “ Au plated
SIM 8P p-p, Normal Type, w/o C/D, 1 u “ Au plated
SIM 8P p-p, Normal Type, w/o C/D, 15 u “ Au plated
SIM 8P p-p, Normal Type, w/o C/D, 30 u “ Au plated
SIM 8P p-p, Reverse Type, w/o C/D, 1 u “ Au plated
SIM 8P p-p, Reverse Type, w/o C/D, 15 u “ Au plated
SIM 8P p-p, Reverse Type, w/o C/D, 30 u “ Au plated
SIM 6P p-p, Reverse Type, w/ C/D, 1 u “ Au plated
SIM 6P p-p, Reverse Type, w/ C/D, 15 u “ Au plated
SIM 6P p-p, Reverse Type, w/ C/D, 30 u “ Au plated
Specifications:
Materials:
Description
Description
Contact Resistance: 50 mΩ max at 100 mA
Insulation Resistance: 500 MΩ min at 500 VDC
Voltage rating: 100V AC
Current Rating: 0.5 A per contact
Dielectric Strenght: 500 VAC/RMS initial and 250 VAC
final at 60 Hz for 1 minute
Operating Temperature: -25°C to +85°C
Housing: High Temperature thermoplastic,
UL94V-0 rated
Contact: Copper alloy with selective Au plating,
Tin plated on solder tail
Cover: SUS Nickle overall
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