MRF6VP2600HR6 Freescale Semiconductor, MRF6VP2600HR6 Datasheet

MOSFET RF N-CH 600W NI1230

MRF6VP2600HR6

Manufacturer Part Number
MRF6VP2600HR6
Description
MOSFET RF N-CH 600W NI1230
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MRF6VP2600HR6

Transistor Type
2 N-Channel (Dual)
Frequency
225MHz
Gain
25dB
Voltage - Rated
110V
Current Rating
2.5mA
Current - Test
2.6A
Voltage - Test
50V
Power - Output
125W
Package / Case
NI-1230
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
110V
Output Power (max)
125W
Power Gain (typ)@vds
24.5/22/25dB
Frequency (min)
2MHz
Frequency (max)
500MHz
Package Type
NI-1230
Pin Count
5
Input Capacitance (typ)@vds
1.7@50VpF
Output Capacitance (typ)@vds
101@50VpF
Reverse Capacitance (typ)
1.7@50VpF
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
28.5%
Mounting
Screw
Mode Of Operation
CW/DVB-T OFDM/Pulsed RF
Number Of Elements
2
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MRF6VP2600HR6
Manufacturer:
TDK-EPCOS
Quantity:
12 000
© Freescale Semiconductor, Inc., 2008--2010. All rights reserved.
RF Device Data
Freescale Semiconductor
Freescale Semiconductor
Technical Data
RF Power Field Effect Transistor
N--Channel Enhancement--Mode Lateral MOSFET
Device is unmatched and is suitable for use in broadcast applications.
• Typical DVB--T OFDM Performance: V
• Typical Pulsed Performance: V
• Capable of Handling 10:1 VSWR, @ 50 Vdc, 225 MHz, 600 Watts Peak
Features
• Characterized with Series Equivalent Large--Signal Impedance Parameters
• CW Operation Capability with Adequate Cooling
• Qualified Up to a Maximum of 50 V
• Integrated ESD Protection
• Designed for Push--Pull Operation
• Greater Negative Gate--Source Voltage Range for Improved Class C
• RoHS Compliant
• In Tape and Reel. R6 Suffix = 150 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
Table 2. Thermal Characteristics
Drain--Source Voltage
Gate--Source Voltage
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
Thermal Resistance, Junction to Case
Designed primarily for wideband applications with frequencies up to 500 MHz.
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
P
Input Signal PAR = 9.3 dB @ 0.01% Probability on CCDF.
P
Cycle = 20%
Power, Pulse Width = 100 μsec, Duty Cycle = 20%
Operation
Case Temperature 99°C, 125 W CW, 225 MHz, 50 Vdc, I
Case Temperature 64°C, 610 W CW, 352.2 MHz, 50 Vdc, I
Case Temperature 81°C, 610 W CW, 88--108 MHz, 50 Vdc, I
out
out
Power Gain — 25 dB
Drain Efficiency — 28.5%
ACPR @ 4 MHz Offset — --61 dBc @ 4 kHz Bandwidth
Power Gain — 25.3 dB
Drain Efficiency — 59%
calculators by product.
Select Documentation/Application Notes -- AN1955.
= 125 Watts Avg., f = 225 MHz, Channel Bandwidth = 7.61 MHz,
= 600 Watts Peak, f = 225 MHz, Pulse Width = 100 μsec, Duty
(1,2)
Characteristic
DD
Rating
= 50 Volts, I
DD
Operation
DD
= 50 Volts, I
DQ
= 2600 mA,
DQ
DQ
DQ
= 2600 mA
DQ
= 150 mA
= 2600 mA,
= 150 mA
Symbol
Symbol
V
R
V
T
T
DSS
T
θJC
GS
stg
Document Number: MRF6VP2600H
C
RF
RF
J
inA
inB
MRF6VP2600HR6
/V
/V
Figure 1. Pin Connections
GSA
GSB
2- -500 MHz, 600 W, 50 V
LATERAL N- -CHANNEL
CASE 375D- -05, STYLE 1
RF POWER MOSFET
PART IS PUSH- -PULL
3
4
-- 65 to +150
BROADBAND
--0.5, +110
Value
--6.0, +10
Value
0.20
0.14
0.16
(Top View)
150
225
NI- -1230
(2,3)
MRF6VP2600HR6
Rev. 5.1, 7/2010
1
2 RF
RF
°C/W
outA
outB
Unit
Unit
Vdc
Vdc
°C
°C
°C
/V
/V
DSA
DSB
1

Related parts for MRF6VP2600HR6

MRF6VP2600HR6 Summary of contents

Page 1

... PART IS PUSH- -PULL inA GSA outA inB GSB outB (Top View) Figure 1. Pin Connections Symbol Value Unit V --0.5, +110 Vdc DSS V --6.0, +10 Vdc +150 °C stg T 150 ° 225 °C J (2,3) Symbol Value Unit R °C/W θJC 0.20 0.14 0.16 MRF6VP2600HR6 /V DSA /V DSB 1 ...

Page 2

... Input Return Loss Typical Performance — 88- -108 MHz (In Freescale 88--108 MHz Test Fixture, 50 ohm system Power Gain Drain Efficiency Input Return Loss 1. Each side of device measured separately. 2. Measurement made with device in push--pull configuration. MRF6VP2600HR6 2 = 25°C unless otherwise noted) A Symbol I GSS V ...

Page 3

... Microstrip Z9, Z10 0.200″ x 0.518″ Microstrip Z11, Z12 0.375″ x 0.214″ Microstrip Figure 2. MRF6VP2600HR6 Test Circuit Schematic Table 5. MRF6VP2600HR6 Test Circuit Component Designations and Values Part B1 95 Ω, 100 MHz Long Ferrite Bead Chip Capacitor ...

Page 4

... B1 C13 C16 C12 + C11 C15 L3 C14 C10 wrapped around R1. Figure 3. MRF6VP2600HR6 Test Circuit Component Layout MRF6VP2600HR6 4 L4, R1 (on side) -- C23 C22 C21 C20 C25 C24 -- -- C18 C19 C17 MRF6VP2600H 225 MHz Rev Device Data Freescale Semiconductor ...

Page 5

... P3dB = 59.7 dBm (938 W) P2dB = 59.1 dBm (827 Vdc 2600 mA 225 MHz DD DQ Pulse Width = 12 μsec, Duty Cycle = INPUT POWER (dBm) in Input Power 2600 mA DQ η D 100 P , OUTPUT POWER (WATTS) PULSED out versus Output Power MRF6VP2600HR6 T = 175_C J 100 Ideal Actual 1000 5 ...

Page 6

... Vdc 222 MHz 228 MHz DD 1300 mA Two--Tone Measurements, 6 MHz Tone Spacing 23.5 20 100 P , OUTPUT POWER (WATTS) PEP out Figure 12. Two- -Tone Power Gain versus Output Power MRF6VP2600HR6 6 -- Vdc 500 W (PEP out Two--Tone Measurements --20 --30 3rd Order --40 5th Order --50 ...

Page 7

... ACPR Measured at 4 MHz Offset from Center Frequency 8K Mode DVB--T OFDM 64 QAM Data Carrier Modulation, 5 Symbols --4 --3 --2 -- FREQUENCY (MHz Vdc 225 MHz = 1300 mA 1800 mA 2600 mA 100 P , OUTPUT POWER (WATTS) AVG. out versus Output Power --56 --30_C --58 --60 η D -- 2600 MHz DQ --66 --68 400 MRF6VP2600HR6 4 5 200 7 ...

Page 8

... Figure 19. MTTF versus Junction Temperature - - CW MRF6VP2600HR6 8 TYPICAL CHARACTERISTICS 110 130 150 170 190 210 T , JUNCTION TEMPERATURE (°C) J This above graph displays calculated MTTF in hours when the device is operated Vdc 125 W Avg., and η DD out MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product ...

Page 9

... DD DQ out source load MHz Ω Ω 225 1.42 + j8.09 4.45 + j1. Test circuit impedance as measured from source gate to gate, balanced configuration Test circuit impedance as measured from load drain to drain, balanced configuration. Device + Under -- Test -- + Z Z source load Output Matching Network MRF6VP2600HR6 9 ...

Page 10

... MRF6VP2600KH Rev. 2 Figure 21. MRF6VP2600HR6 Test Circuit Component Layout — 88- -108 MHz Table 6. MRF6VP2600HR6 Test Circuit Component Designations and Values — 88- -108 MHz Part B1 95 Ω, 100 MHz Long Ferrite Bead C1 6.8 μ Chip Capacitor Chip Capacitor C3, C13, C14 1000 pF Chip Capacitors C4, C5 μ ...

Page 11

... MHz Vdc 150 108 MHz MHz 88 MHz η D 200 300 400 500 600 700 P , OUTPUT POWER (WATTS) out Vdc 150 600 W, CW out G ps η 102 f, FREQUENCY (MHz) versus Frequency — 88- -108 MHz MHz 70 88 MHz 800 106 110 MRF6VP2600HR6 11 ...

Page 12

... Ω o Input Matching Network Figure 24. Series Equivalent Source and Load Impedance — 88- -108 MHz MRF6VP2600HR6 MHz f = 108 MHz Z source Z load f = 108 MHz MHz Vdc 150 mA 600 W Avg out source load MHz Ω Ω 88 3.20 + j14.50 10.35 + j2.80 98 4.20 + j15.00 9.50 + j3.00 108 4 ...

Page 13

... L2 C6 C10 B2 C8 C12 *Mounted on side Figure 25. MRF6VP2600HR6 Test Circuit Component Layout — 352.2 MHz Table 7. MRF6VP2600HR6 Test Circuit Component Designations and Values — 352.2 MHz Part B1 Ω, 100 MHz Short Ferrite Beads C1, C2 100 pF Chip Capacitors C3*, C24 Chip Capacitors C4* ...

Page 14

... TYPICAL CHARACTERISTICS — 352.2 MHz Figure 26. CW Power Gain and Drain Efficiency MRF6VP2600HR6 Vdc 150 352.2 MHz η D 100 P , OUTPUT POWER (WATTS) CW out versus Output Power 1000 RF Device Data Freescale Semiconductor ...

Page 15

... Z Z source MHz Ω 352.2 1.10 + j3.80 2.26 + j3. Test circuit impedance as measured from source gate to gate, balanced configuration Test circuit impedance as measured from load drain to drain, balanced configuration. Device + Under -- Test -- + Z Z source load Ω o load Ω Output Matching Network MRF6VP2600HR6 15 ...

Page 16

... MRF6VP2600HR6 16 PACKAGE DIMENSIONS RF Device Data Freescale Semiconductor ...

Page 17

... RF Device Data Freescale Semiconductor MRF6VP2600HR6 17 ...

Page 18

... The 88--108 MHz application circuit is also now a more compact size., p. 10--12 5.1 July 2010 • Fig. 24, Series Impedance for 88--108 MHz, table and plot updated to reflect correct location load MRF6VP2600HR6 18 REVISION HISTORY Description and Z values from 1.58 + j6.47 to 1.42 + j8.09 and 4.60 + j1.85 to 4.45 + j1.16 and re- load copy to read ” ...

Page 19

... Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008--2010. All rights reserved. MRF6VP2600HR6 19 ...

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