ATF-33143-TR1G Avago Technologies US Inc., ATF-33143-TR1G Datasheet - Page 16

IC PHEMT 1.9GHZ 80MA LN SOT-343

ATF-33143-TR1G

Manufacturer Part Number
ATF-33143-TR1G
Description
IC PHEMT 1.9GHZ 80MA LN SOT-343
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of ATF-33143-TR1G

Gain
15dB
Transistor Type
pHEMT FET
Frequency
2GHz
Voltage - Rated
5.5V
Current Rating
305mA
Noise Figure
0.5dB
Current - Test
80mA
Voltage - Test
4V
Power - Output
22dBm
Package / Case
SC-70-4, SC-82-4, SOT-323-4, SOT-343
Drain Source Voltage Vds
5.5V
Power Dissipation Pd
600mW
Noise Figure Typ
0.5dB
Rf Transistor Case
SOT-343
No. Of Pins
4
Frequency Max
6GHz
Frequency Min
450MHz
Drain Current Idss Max
305mA
Channel Type
N
Configuration
Single Dual Source
Gate-source Voltage (max)
5V
Pin Count
3 +Tab
Drain-gate Voltage (max)
-5V
Drain-source Volt (max)
5.5V
Operating Temperature (min)
-65C
Operating Temperature (max)
160C
Operating Temperature Classification
Military
Mounting
Surface Mount
Drain Current (max)
305mA
Package Type
SOT-343
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATF-33143-TR1G
Manufacturer:
AVAGO
Quantity:
150 000
Part Number:
ATF-33143-TR1G
Manufacturer:
NS
Quantity:
9 030
Part Number:
ATF-33143-TR1G
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number Ordering Information
Package Dimensions
SC-70 4L/SOT-343
16
HE
ATF-33143-TR1G
ATF-33143-TR2G
ATF-33143-BLKG
SYMBOL
A
Part Number
HE
A2
A1
b1
E
D
A
b
L
c
b
1.30 (.051)
MIN.
1.15
1.85
1.80
0.80
0.80
0.00
0.25
0.55
0.10
0.10
BSC
D
DIMENSIONS (mm)
b1
Devices
10000
No. of
3000
100
A1
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
0.40
0.70
0.20
0.46
1.15 (.045) BSC
A2
E
antistatic bag
Container
13” Reel
7” Reel
NOTES:
1. All dimensions are in mm.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to EIAJ SC70.
5. Die is facing up for mold and facing down for trim/form, ie: reverse trim/form.
6. Package surface to be mirror finish.
L
C

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