MPN3700G ON Semiconductor, MPN3700G Datasheet
MPN3700G
Specifications of MPN3700G
Related parts for MPN3700G
MPN3700G Summary of contents
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These devices are designed primarily for VHF band switching applications but are also suitable for use in general–purpose switching circuits. They are supplied in a cost–effective plastic package for economical, high–volume consumer and industrial requirements. They are also available ...
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MMBV3700LT1 MPN3700 TYPICAL CHARACTERISTICS Figure 1. Series Resistance Figure 3. Diode Capacitance http://onsemi.com Figure 2. Forward Voltage Figure 4. Leakage Current 2 ...
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INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure ...
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Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of ...
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MMBV3700LT1 MPN3700 PACKAGE DIMENSIONS SOT–23 (TO–236AB http://onsemi.com CASE 318–08 ISSUE ...
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MMBV3700LT1 MPN3700 PACKAGE DIMENSIONS TO–92 (TO–226AC http://onsemi.com CASE 182–06 ISSUE L D É É J É É SECTION X–X 6 ...
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Notes MMBV3700LT1 MPN3700 http://onsemi.com 7 ...
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... Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800–282–9855 Toll Free USA/Canada MMBV3700LT1 MPN3700 JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi ...