LE87220KQC Zarlink, LE87220KQC Datasheet - Page 5

• Manufacturer Part Number: LE87220KQC
• Description: World Wide xDSL Line Driver 24-Pin QFN Tray
• Manufacturer: Zarlink

Specifications of LE87220KQC

• Package: 24QFN
• Transmission Media Type: Copper
• Power Supply Type: Analog
• Typical Operating Supply Voltage: 3.3 V
• Minimum Operating Supply Voltage: 3.13 V
• Maximum Operating Supply Voltage: 3.46 V

ABSOLUTE MAXIMUM RATINGS
Stresses above the values listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to absolute maximum ratings for extended periods can affect device reliability.
Notes:
1.
2.
Thermal Resistance
The junction to air thermal resistance of the Le87220 device in a 24-pin QFN package is 30°C/W (measured with infinite external
heat sinking). Please refer to Zarlink’s QFN Package application note, available from
sinking guidelines.
Package Assembly
The standard (non-green) package devices are assembled with industry-standard mold compounds, and the leads possess a tin/
lead (Sn/Pb) plating. These packages are compatible with conventional SnPb eutectic solder board assembly processes. The
peak soldering temperature should not exceed 225°C during printed circuit board assembly.
The green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
OPERATING RANGES
Zarlink guarantees the performance of this device over commercial (0°C to 70°C) and industrial (−40°C to 85°C) temperature
ranges by conducting electrical characterization over each range and by conducting a production test with single insertion coupled
with periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE
Component Reliability Assurance Requirements for Telecommunications Equipment.
The Le87220 is designed to operate with a standard telecom battery. The normal operating voltage of such batteries is -52 V, and
the Le87220 is designed to give optimal performance in terms of power dissipation if used with the provided applications circuit.
However, because the Le87220 is designed on Zarlink’s proprietary high voltage, high bandwidth process, the part will continue
to remain in operation without any degradation in data performance should the battery drop to as low as -42 V, or charge to as
high as -72 V. Should there be a need to operate the part continuously at such voltages, a different applications circuit should be
considered to achieve best power performance. Lower voltage operation can be achieved by adding a buck-boost regulator.
The Le87220 is designed to operate with the T1.315 specified telecom battery, without any need for changes in the reference
design.
Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 165°C. Continuous operation above 145°C
junction temperature may degrade device reliability.
The thermal performance of a thermally enhanced package is assured through optimized printed circuit board layout. Specified performance
requires that the exposed thermal pad be soldered to an equally sized exposed copper surface, which, in turn, conducts heat through
multiple vias to a large internal copper plane
Ambient temperature
V
V
BGND with respect to AGND
CC
BAT
Storage Temperature
Ambient temperature, under bias
V
V
BGND with respect to AGND (1 ms)
Maximum Current into AY, BY
Peak current output, AY or BY pins
Pdown, DISCON pins with respect to AGND
Maximum Power Dissipation, T
(See Notes 1 and 2)
ESD Immunity (Human Body Model)
ESD Immunity (Charge Device Model)
CC
BAT
with respect to AGND
Continuous
100 µs (F = 0.1 Hz)
1 µs (F = 0.1 Hz)
250 ns (F = 0.1 Hz)
with respect to BGND
(See PCB Layout, on page
Zarlink Semiconductor Inc.
A
= 85°C
5
8.).
−55 ≤ T
−40 ≤ T
−0.4 V to +6 V
+0.4 V to -75 V
−5.5 V to +0.2 V
±200 mA
±1 A
±2.5 A
±5.5 A
±200 mA
–0.4 V to (V
2 W
JESD22 Class 1C compliant
Class C6 1500 - 2000 V
-40°C to +85°C
+3.3 V ± 5%
-42 V to -72 V
-2 to +0.1VDC
A
A
≤ +150°C
≤ +85°C
http://www.zarlink.com
CC
+ 0.4 V)
, for layout and heat