BAP70-04W,115 NXP Semiconductors, BAP70-04W,115 Datasheet - Page 7

• Manufacturer Part Number: BAP70-04W,115
• Description: DIODE PIN 50V 100MA SOT-323
• Manufacturer: NXP Semiconductors

Specifications of BAP70-04W,115

• Package / Case: SC-70-3, SOT-323-3
• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 50V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
• Resistance @ If, F: 1.9 Ohm @ 100mA, 100MHz
• Power Dissipation (max): 260mW
• Configuration: Dual Series
• Reverse Voltage: 50 V
• Forward Continuous Current: 100 mA
• Termination Style: SMD/SMT
• Carrier Life: 1.25 us
• Forward Voltage Drop: 0.95 V
• Maximum Diode Capacitance: 0.3 pF @ 20 V
• Maximum Operating Temperature: + 150 C
• Maximum Series Resistance @ Maximum If: 1.4 Ohms
• Maximum Series Resistance @ Minimum If: 77 Ohms
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Power Dissipation: 260 mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934057966115; BAP70-04W T/R; BAP70-04W T/R

NXP Semiconductors
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
Contact information. . . . . . . . . . . . . . . . . . . . . . 6
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
BAP70-04W
Document identifier: BAP70-04W_2
Silicon PIN diode
Date of release: 3 April 2007
All rights reserved.