BAP50-04,215 NXP Semiconductors, BAP50-04,215 Datasheet - Page 2

• Manufacturer Part Number: BAP50-04,215
• Description: DIODE PIN GP 50V 50MA SOT-23
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of BAP50-04,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 50V
• Current - Max: 50mA
• Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
• Resistance @ If, F: 5 Ohm @ 10mA, 100MHz
• Power Dissipation (max): 250mW
• Configuration: Dual Series
• Reverse Voltage: 50 V
• Forward Continuous Current: 50 mA
• Carrier Life: 1.05 us
• Forward Voltage Drop: 1.1 V
• Maximum Diode Capacitance: 0.5 pF at 5 V
• Maximum Operating Temperature: + 150 C
• Maximum Series Resistance @ Maximum If: 5 Ohms at 10 mA
• Maximum Series Resistance @ Minimum If: 40 Ohms at 0.5 mA
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Power Dissipation: 250 mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1917-2; 934055687215; BAP50-04 T/R

NXP Semiconductors
FEATURES
 Two elements in series configuration in a small-sized
 Low diode capacitance
 Low diode forward resistance.
APPLICATIONS
 General RF applications.
DESCRIPTION
Two planar PIN diodes in series configuration in an SOT23
small plastic SMD package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
1999 Dec 03
Per diode
V
I
P
T
T
SYMBOL
F
plastic SMD package
stg
j
R
tot
General purpose PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
= 90 C
2
PINNING
handbook, halfpage
CONDITIONS
Marking code: 4Lp.
Fig.1 Simplified outline (SOT23) and symbol.
2
PIN
1
2
3
3
1
anode
cathode
common connection



65
65
MIN.
Product specification
2
DESCRIPTION
50
50
250
+150
+150
BAP50-04
MAX.
3
V
mA
mW
C
C
MAM232
UNIT
1