B32656S105K562 EPCOS (TDK), B32656S105K562 Datasheet - Page 25

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B32656S105K562

Manufacturer Part Number
B32656S105K562
Description
Manufacturer
EPCOS (TDK)
Datasheet

Specifications of B32656S105K562

Package/case
42(Max) X 20(Max) X 39.5(Max)
Mounting
Solder Lug
Capacitance Value
1 uF
Voltage
1000|480 Vdc|Vac
Dielectric
PP
Product Length
42(Max) mm
Product Height
39.5(Max) mm
Product Depth
20(Max) mm
Tolerance
10 %
Operating Temperature
-55 to 100 °C
B32656S
Snubber (wound)
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Page 25 of 31
Important notes at the end of this document.

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