NSHC222J50TRA1F NIC Components, NSHC222J50TRA1F Datasheet
NSHC222J50TRA1F
Manufacturer Part Number
NSHC222J50TRA1F
Description
Cap Film 0.0022uF 50VDC PPS 5% 2 X 1.25 X 0.9mm SMD T/R
Manufacturer
NIC Components
Datasheet
1.NSHC153J50TRC1F.pdf
(4 pages)
Specifications of NSHC222J50TRA1F
Package/case
0805
Mounting
Surface Mount
Capacitance Value
0.0022 uF
Voltage
50 Vdc
Dielectric
PPS
Product Length
2 mm
Product Height
0.9 mm
Product Depth
1.25 mm
Tolerance
5 %
Operating Temperature
-55 to 125 °C
Stacked Film Capacitor Chips
NIC COMPONENTS CORP.
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC ABSORPTION CHARACTERISTICS
• SUITABLE FOR REFLOW SOLDERING
• TAPE AND REEL PACKAGING
ENVIRONMENTAL CHARACTERISTICS
Dielectric Withstanding Voltage
(3) 500 Hours +85°C/85% RH
Insulation Resistance (20°C)
Resistance to Soldering Heat
25% Wt Rosin-Methanol Flux
Temperature Characteristic
Dissipation Factor (20°C)
300
250
200
150
100
Capacitance Tolerance
1,000 Hours at 125% of
50
25
(1) 1000 Hours, +40°C
0
Dielectric Absorption
(2) 500 Hours, +60°C
Temperature Range
Capacitance Range
Solder within 1 year. Storage at +30°C and 60% RH
Life Test At +125°C
SPECIFICATIONS
Humidity Load Life:
Solderability with
®
Voltage Ratings
Rated Voltage
+260°C Peak
25°C ~ 150°C
90 sec. max.
RECOMMENDED REFLOW PROFILE
Ramp-up
(maximum 2 times)
150°C ~ 180°C
120 sec. max.
Pre-heat
Time
100pF ~ 0.0027μF 100pF ~ .01μF 3300pF ~ .047μF .012μF ~ .1μF .047μF ~ .1μF
Insulation Resistance
Insulation Resistance
Insulation Resistance
www.niccomp.com
Capacitance Change
Capacitance Change
Capacitance Change
Dissipation Factor
Dissipation Factor
Dissipation Factor
Time above 230°C
0603
30 sec. max.
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
O
-55°C ~ +125°C (0.12μF ~ 0.22μF voltage derated above +105°C)
C (100pF ~ 0.1μF)
Peak Temperature
Cool Down
0805
260°C
(1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min.
www.lowESR.com
(1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value
±3% ΔC Maximum Over Temperature Range
150% of Rated Voltage 60 Seconds or
16Vdc (12Vrms), 50Vdc (40Vrms)
(1) & (2) 0.90% Maximum (3) 1.2% maximum
0.05 ~ 0.10% Typical
3 Gigohms Minimum
0.6% max. @ 1KHz
±5% Std, ±2% Opt.
1206
Case Sizes
Within ±2% of Initial Value
Within ±3% of Initial Value
1 Gigohm Minimum
1 Gigohm Minimum
www.RFpassives.com
0.68% Maximum
0.66% Maximum
includes all homogeneous materials
FOR NEW DESIGNS
1210
RECOMMENDED
Compliant
NSHC IS
RoHS
RECOMMENDED LAND
PATTERN (mm)
EIA Size
0603
0805
1206
1210
1913
2416
1913
0.6
0.8
1.8
1.8
3.0
4.0
A
www.SMTmagnetics.com
A
B
NSHC Series
2.0
2.4
3.6
3.6
5.6
7.0
.12μF ~ .22μF
B
2416
0.7
1.1
1.4
2.3
3.0
3.8
C
77
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NSHC222J50TRA1F Summary of contents
Page 1
... Time Solder within 1 year. Storage at +30°C and 60% RH ® NIC COMPONENTS CORP. www.niccomp.com O C (100pF ~ 0.1μF) Case Sizes 0805 1206 16Vdc (12Vrms), 50Vdc (40Vrms) ±5% Std, ±2% Opt. ...
Page 2
... C3 D6 0.10 104 C3 D6 0.12 124 - E6 0.15 154 - E6 0.18 184 - E7 0.22 224 - E8 ® NIC COMPONENTS CORP. www.niccomp.com 78 DIMENSION (mm) AND CASE CODE Case Length Width Code L ±0 1.6 0.8 ± 0.15 A1 2.0 1.25 ± 0 3.2 1.6 ± 0 3.2 2.5 ± 0.2 ...
Page 3
... Ramp-up 150°C ~ 180°C 25°C ~ 150°C 150 sec. max. 90 sec. max. 0 Time Solder within 6 year. Storage at +35°C and 85% RH ® NIC COMPONENTS CORP Case Sizes 1913 2416 0.01 ~ 0.027μF 0.033 ~ .068μF 100Vdc (40Vrms) max. ±5% Std, ±2% Opt. ...
Page 4
... 6.91 8.43 5.686 0.013 EMBOSSED PLASTIC CARRIER 1.5 +0 ® NIC COMPONENTS CORP. www.niccomp.com Length Width Height 1.4 ± 0.2 4.8 ± 0.2 3.3 ± 0.3 2.0 ± 0.2 2.4 ± 0.2 2.8 ± 0.2 1.8 ± 0.2 2.0 ± ...