HSMP-3814-BLKG Avago Technologies US Inc., HSMP-3814-BLKG Datasheet - Page 5

• Manufacturer Part Number: HSMP-3814-BLKG
• Description: DIODE PIN ATTENUATOR CC SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-3814-BLKG

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Type: PIN - 1 Pair Common Cathode
• Voltage - Peak Reverse (max): 100V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.35pF @ 50V, 1MHz
• Resistance @ If, F: 3 Ohm @ 100mA, 100MHz
• Configuration: Dual Common Cathode
• Reverse Voltage: 100 V
• Forward Continuous Current: 1 A
• Termination Style: SMD/SMT
• Carrier Life: 1.5 us
• Maximum Diode Capacitance: 0.35 pF @ 50 V
• Maximum Operating Temperature: + 150 C
• Maximum Series Resistance @ Maximum If: 3 Ohm @ 100 mA
• Maximum Series Resistance @ Minimum If: 53 Ohm (Typ) @ 1 mA
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Recovery Time: 300 nS
• Capacitance, Junction: 0.27 pF
• Current, Forward: 1 A
• Package Type: SOT-23
• Primary Type: Pin
• Resistance, Thermal, Junction To Case: 500 °C/W
• Speed, Switching: RF
• Temperature, Junction, Maximum: +150 °C
• Time, Recovery: 300 ns
• Voltage, Reverse: 100 V
• Diode Case Style: SOT-23
• Breakdown Voltage: 100V
• Capacitance Ct: 0.27pF
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1903; HSMP-3814-BLKG

Typical Applications for HSMP-481x Low Inductance Series (continued)
Co-Planar Waveguide Shunt Connection for HSMP-481x
Series
Co-Planar waveguide, with ground on the top side of the
printed circuit board, is shown in Figure 10. Since it elimi-
nates the need for via holes to ground, it offers lower shunt
parasitic inductance and higher maximum attenuation
when compared to microstrip circuit.
Figure 10. Circuit Layout.
Figure 11. Equivalent Circuit.
5
R
j
0.75 nH
0.3 pF
Co-Planar Waveguide
Center Conductor
Groundplane
Groundplane
Equivalent Circuit Model
HSMP-381x Chip*
R
C
I = Forward Bias Current in mA
R
*See AN1124 for package models.
T
T
j
=
= 2.5 + R
= C
80
I
P
0.9
+ C
Ω
j
j
2.5 Ω
R
s
* Measured at -20 V
0.18 pF*
R
C
j
j