HSMP-3814-BLKG Avago Technologies US Inc., HSMP-3814-BLKG Datasheet - Page 3

• Manufacturer Part Number: HSMP-3814-BLKG
• Description: DIODE PIN ATTENUATOR CC SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-3814-BLKG

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Type: PIN - 1 Pair Common Cathode
• Voltage - Peak Reverse (max): 100V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.35pF @ 50V, 1MHz
• Resistance @ If, F: 3 Ohm @ 100mA, 100MHz
• Configuration: Dual Common Cathode
• Reverse Voltage: 100 V
• Forward Continuous Current: 1 A
• Termination Style: SMD/SMT
• Carrier Life: 1.5 us
• Maximum Diode Capacitance: 0.35 pF @ 50 V
• Maximum Operating Temperature: + 150 C
• Maximum Series Resistance @ Maximum If: 3 Ohm @ 100 mA
• Maximum Series Resistance @ Minimum If: 53 Ohm (Typ) @ 1 mA
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Recovery Time: 300 nS
• Capacitance, Junction: 0.27 pF
• Current, Forward: 1 A
• Package Type: SOT-23
• Primary Type: Pin
• Resistance, Thermal, Junction To Case: 500 °C/W
• Speed, Switching: RF
• Temperature, Junction, Maximum: +150 °C
• Time, Recovery: 300 ns
• Voltage, Reverse: 100 V
• Diode Case Style: SOT-23
• Breakdown Voltage: 100V
• Capacitance Ct: 0.27pF
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1903; HSMP-3814-BLKG

Absolute Maximum Ratings
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T
Electrical Specifications T
Conventional Diodes
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes
2
Symbol
I
P
T
T
q
Part
Number
HSMP-
3810
3812
3813
3814
381B
381C
381E
381F
Test Conditions
Part
Number
HSMP-
4810
481B
Test Conditions
f
stg
j
IV
jc
C
= +25°C, where T
Parameter
Forward Current (1 µs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
Package
Marking
Package
Marking
Code
Code
EB
EB
E0
E2
E3
E4
E0
E2
E3
E4
C
is defined to be the temperature at the package pins where contact is made to the circuit board.
Code
Lead
Lead
Code
B
0
2
3
4
C
E
F
B
B
[2]
C
= +25°C (Each Diode)
[1]
Common Cathode
Common Cathode
Common Anode
Common Anode
T
Configuration
Configuration
C
Dual Cathode
Dual Cathode
= +25°C
Single
Single
Series
Series
Unit
Amp
V
°C
°C
°C/W
Breakdown
Voltage V
Breakdown
Minimum
Minimum
I
I
Measure
V
R
Voltage
Measure
R
V
SOT-23
1
Same as V
150
-65 to 150
500
≤ 10uA
V
R
≤ 10μA
R
100
BR
(V)
100
= V
= V
(V)
BR
BR
BR
BR
Capacitance
Resistance
f = 100MHz
Maximum
I
Maximum
F
f = 1MHz
V
= 100mA
C
Series
R
R
Total
T
0.35
= 50V
S
(pF)
3
(Ω)
SOT-323
1
Same as V
150
-65 to 150
150
I
Resistance
f = 100MHz
BR
F
I
Resistance
f = 100MHz
I
Minimum
F
I
= 0.01mA,
F
= 0.01mA
F
Series
R
48 - 70
RH (Ω)
= 1mA,
= 1mA
1500
M
at
(Ω)
Capacitance
Resistance
f = 100MHz
I
Maximum
F
I
F
f = 1MHz
V
= 20mA,
Typical
= 20mA
C
R
R
Total
0.35
T
L
= 50V
10
at
(pF)
(Ω)
I
Resistance
f = 100MHz
Capacitance
Maximum
F
I
F
Maximum
= 100mA,
= 100mA
f = 1MHz
V
RT (Ω)
C
R
Total
3.0
T
at
= 50V
0.4
(pF)
Resistance
f = 100MHz
Inductance
f = 500MHz
I
F
I
48 to 70
F
R
Typical
= 1mA,
L
= 1mA
- 3GHz
Total
T
M
at
(nH)
(Ω)
1