RV UVK105 CH0R4BW-F Taiyo Yuden, RV UVK105 CH0R4BW-F Datasheet - Page 10
![no-image](/images/manufacturer_photos/0/6/649/taiyo_yuden_sml.jpg)
RV UVK105 CH0R4BW-F
Manufacturer Part Number
RV UVK105 CH0R4BW-F
Description
Cap Ceramic 0.4pF 50VDC CH 0.1pF SMD 0402 T/R
Manufacturer
Taiyo Yuden
Type
Flatr
Datasheet
1.UVK105CH0R6BW-F.pdf
(15 pages)
Specifications of RV UVK105 CH0R4BW-F
Package/case
0402
Mounting
Surface Mount
Capacitance Value
0.4 pF
Dielectric
CH
Voltage
50 Vdc
Product Length
1 mm
Product Height
0.5 mm
Tolerance
0.1 pF
Precautions on the use of Multilayer Ceramic Capacitors
1.Circuit Design
2.PCB Design
△
!
PRECAUTIONS
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Stages
(Design of Land-patterns)
Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear
Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be lower
2. Even if the applied voltage is lower than the rated value, the
Pattern configurations
1. When capacitors are mounted on a PCB, the amount of
(1) The amount of solder applied can affect the ability of
(2) When more than one part is jointly soldered onto the
reactors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
solder used (size of fillet) can directly affect capacitor per-
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
Precautions
1.The following diagrams and tables show some examples of recommended patterns to
Recommended land dimensions for wave-soldering (unit: mm)
Recommended land dimensions for reflow-soldering (unit: mm)
Size
Excess solder can affect the ability of chips to withstand mechanical stresses. There-
fore, please take proper precautions when designing land-patterns.
Size
Type
prevent excessive solder amourts. ( larger fillets which extend above the component
end terminations)
Examples of improper pattern designs are also shown.
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs
Type
Type
Type
b
d
a
b
c
d
a
c
A
B
C
A
B
C
W
W
L
L
W
L
W
L
212 (2 circuits) 110(2 circuits) 096(2 circuits)
212 (4 circuits)
0.15∼0.25 0.20∼0.30 0.45∼0.55 0.8∼1.0 0.8∼1.2 1.8∼2.5 1.8∼2.5 2.5∼3.5
0.10∼0.20 0.20∼0.30 0.40∼0.50 0.6∼0.8 0.8∼1.2 1.0∼1.5 1.0∼1.5 1.5∼1.8
0.15∼0.30 0.25∼0.40 0.45∼0.55 0.6∼0.8 0.9∼1.6 1.2∼2.0 1.8∼3.2 2.3∼3.5
0.5∼0.6
0.5∼0.6
0.2∼0.3
0.5∼0.6
0.5∼0.6
0.5∼0.6
0.8∼1.0
0.5∼0.8
0.6∼0.8
042
1.25
1.25
0.4
0.2
2.0
1.0
2.0
0.5
107
1.6
0.8
△
063
0.6
0.3
0.35∼0.45
0.55∼0.65
1.0∼1.4
0.8∼1.5
0.9∼1.2
!
0.3∼0.4
51.25
212
2.0
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
1.37
0.64
1.0
Technical considerations
105
1.0
0.5
1.8∼2.5
0.8∼1.7
1.2∼1.6
0.25∼0.35
0.15∼0.25
0.15∼0.25
316
3.2
1.6
0.45
0.9
0.6
107
1.6
0.8
1.8∼2.5
0.8∼1.7
1.8∼2.5
325
3.2
2.5
51.25
212
2.0
316
3.2
1.6
325
3.2
2.5
1/6
432
4.5
3.2
109
4