HSMP-3822-TR1G Avago Technologies US Inc., HSMP-3822-TR1G Datasheet - Page 5

DIODE PIN SWITCH 50V SOT-23

HSMP-3822-TR1G

Manufacturer Part Number
HSMP-3822-TR1G
Description
DIODE PIN SWITCH 50V SOT-23
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HSMP-3822-TR1G

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Diode Type
PIN - 1 Pair Series Connection
Voltage - Peak Reverse (max)
50V
Current - Max
1A
Capacitance @ Vr, F
0.8pF @ 20V, 1MHz
Resistance @ If, F
600 mOhm @ 10mA, 100MHz
Configuration
Dual Series
Reverse Voltage
50 V
Forward Continuous Current
1 A
Frequency Range
UHF
Termination Style
SMD/SMT
Carrier Life
0.07 us
Maximum Diode Capacitance
0.8 pF @ 20 V
Maximum Operating Temperature
+ 150 C
Maximum Series Resistance @ Maximum If
0.6 Ohm @ 10 mA
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Recovery Time
7 nS
Diode Case Style
SOT-23
Breakdown Voltage
50V
Capacitance Ct
0.8pF
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Reel Quantity
3000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
516-1802-2
HSMP-3822-TR1G

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSMP-3822-TR1G
Manufacturer:
AVAGO
Quantity:
769
Part Number:
HSMP-3822-TR1G
Manufacturer:
AVAGO
Quantity:
223 697
Typical Applications for HSMP-482x Low Inductance
Series
Microstrip Series Connection for HSMP-482x Series
In order to take full advantage of the low inductance
of the HSMP-482x series when using them in series
applications, both lead 1 and lead 2 should be connected
together, as shown in Figure 14.
Figure 13. Internal Connections.
Figure 13. Internal Connections.
Figure 14. Circuit Layout.
Figure 14. Circuit Layout.
Microstrip Shunt Connections for HSMP-482x Series
In Figure 15, the center conductor of the microstrip line
is interrupted and leads 1 and 2 of the HSMP-482x diode
are placed across the resulting gap. This forces the 0.5
nH lead inductance of leads 1 and 2 to appear as part of
a low pass filter, reducing the shunt parasitic inductance
and increasing the maximum available attenuation.
The 0.3 nH of shunt inductance external to the diode
is created by the via holes, and is a good estimate for
0.032" thick material.
Figure 15. Circuit Layout, HSMP-482x Limiter.
Figure 15. Circuit Layout,
HSMP-482x Limiter.
5
50 OHM MICROSTRIP LINES
1
HSMP-482x
PAD CONNECTED TO
GROUND BY TWO
3
VIA HOLES
2
Figure 16. Equivalent Circuit.
Figure 16. Equivalent Circuit.
Co-Planar Waveguide Shunt Connection for HSMP-482x Series
Co-Planar waveguide, with ground on the top side of
the printed circuit board, is shown in Figure 17. Since
it eliminates the need for via holes to ground, it offers
lower shunt parasitic inductance and higher maximum
attenuation when compared to a microstrip circuit. See
AN1050 for details.
Figure 17. Circuit Layout.
Figure 18. Equivalent Circuit.
Figure 18. Equivalent Circuit.
Figure 17. Circuit Layout.
1.5 nH
0.75 nH
0.3 nH
0.3 nH
0.8 pF
Co-Planar Waveguide
0.8 pF
Groundplane
Center Conductor
Groundplane
1.5 nH

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