GRM1885C1H1R5BZ01D Murata Electronics, GRM1885C1H1R5BZ01D Datasheet - Page 216
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GRM1885C1H1R5BZ01D
Manufacturer Part Number
GRM1885C1H1R5BZ01D
Description
Cap Ceramic 1.5pF 50VDC C0G 0.1pF SMD 0603 Paper T/R
Manufacturer
Murata Electronics
Type
Flatr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM1885C1H1R5BZ01D
Package/case
0603
Mounting
Surface Mount
Capacitance Value
1.5 pF
Dielectric
C0G
Voltage
50 Vdc
Product Length
1.6 mm
Product Height
0.8 mm
Tolerance
0.1 pF
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Land Layout to Prevent Excessive Solder
2. Mounting of Chips
3. Soldering
(1) Limit of losing effective area of the terminations and
Examples
to Be Avoided
Examples of
Improvements
by the Land
Division
Thickness of adhesives applied
Keep thickness of adhesives applied (50-105 m or more)
to reinforce the adhesive contact considering the
thickness of the termination or capacitor (20-70 m) and
the land pattern (30-35 m).
Mechanical shock of the chip placer
When the positioning claws and pick-up nozzle are worn,
the load is applied to the chip while positioning is
concentrated in one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. Please set the suction nozzle's
bottom dead point on the upper surface of the board.
conditions needed for soldering.
Continued from the preceding page.
Depending on the conditions of the soldering
temperature and/or immersion (melting time),
effective areas may be lost in some parts of the
terminations.
To prevent this, be careful in soldering so that any
possible loss of the effective area on the terminations
will securely remain at a maximum of 25% on all
edge length A-B-C-D-A of part with A, B, C, D, shown
in the Figure below.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Solder Resist
Mounting Close to a Chassis
d
d
1
Chassis
2
Land Pattern
B
Base board
Solder (Ground solder)
d
C
1
<d
Adhesive
2
in section
in section
A
D
Termination
Mounting with Leaded Components
Solder Resist
(2) Flux Application
(3) Solder
An excessive amount of flux generates a large quantity of
Flux containing too high a percentage of halide may
Do not use strong acidic flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non rosin type flux
flux gas, causing deteriorated solderability. So apply flux
thinly and evenly throughout. (A foaming system is
generally used for flow soldering.)
cause corrosion of the outer electrodes without sufficient
cleaning. Use flux with a halide content of 0.2% max.
including wash-type flux and non-wash-type flux.)
The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
Lead Wire Connected
to a Part Provided
with Lead Wires.
in section
in section
Mounting Leaded Components Later
Continued on the following page.
Solder Resist
Soldering Iron
Lead Wire of
Component to be
Connected Later.
Notice
in section
in section
215
C02E.pdf
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