MAL215097002E3 Vishay, MAL215097002E3 Datasheet - Page 4
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MAL215097002E3
Manufacturer Part Number
MAL215097002E3
Description
Cap Aluminum 330uF 35VDC 20% 10 X 14mm SMD 790mA 3000 hr Blister T/R
Manufacturer
Vishay
Datasheet
1.MAL215099301E3.pdf
(13 pages)
Specifications of MAL215097002E3
Mounting
Surface Mount
Capacitance Value
330 uF
Voltage
35 Vdc
Product Height
14 mm
Operating Temperature
-55 to 105 °C
Tolerance
20 %
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
MOUNTING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print layout
and/or adjacent components. For recommended soldering
pad dimensions, refer to Fig.3 and Table 3.
Table 3
Document Number: 28395
Revision: 02-Feb-11
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE CODE
0810
1010
1014
1213
1216
1616
1621
1816
1821
b
Case size Ø D ≤ 10 mm
a
c
4.4
4.4
4.4
6.3
6.3
7.8
7.8
8.8
8.8
a
a
For technical questions, contact:
Fig.3 Recommended soldering pad dimensions
2.5
2.5
2.5
2.5
2.5
9.6
9.6
9.6
9.6
b
SMD (Chip), Very Low Z
Aluminum Capacitors
b
Case size Ø D = 12.5 mm
a
3.0
4.0
4.0
4.0
4.0
4.7
4.7
4.7
4.7
e
c
c
aluminumcaps1@vishay.com
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
component during processing.
For maximum conditions refer to Fig.4 or Fig.5.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
As a general principle, temperature and duration shall be the
minimum necessary required to ensure good soldering
connections. However, the specified maximum curves
should never be exceeded.
a
d
f
d
4.2
4.2
d
-
-
-
-
-
-
-
Vishay BCcomponents
b
Case size Ø D ≥ 16 mm
5.0
5.0
e
-
-
-
-
-
-
-
a
c
150 CRZ
www.vishay.com
a
5.6
5.6
f
-
-
-
-
-
-
-
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