SSM2166SZ Analog Devices Inc, SSM2166SZ Datasheet

SSM2166SZ

Manufacturer Part Number

SSM2166SZ

Description

Audio Amp Microphone 1-CH Mono Class-AB 14-Pin SOIC N

Manufacturer

Analog Devices Inc

Datasheets

1.SSM2166SZ-REEL7.pdf (20 pages)

2.SSM2166SZ.pdf (5 pages)

Specifications of SSM2166SZ

Package

14SOIC N

Function

Microphone

Amplifier Type

Class-AB

Typical Voltage Gain

60 dB

Total Harmonic Distortion Noise

0.25@100000Ohm %

Typical Psrr

50 dB

Typical Gain Bandwidth Product

30 MHz

Maximum Load Resistance

100000 Ohm

Output Type

1-Channel Mono

Voltage - Supply

4.5 V ~ 5.5 V

Features

Microphone

Mounting Type

Surface Mount

Package / Case

14-SOIC (3.9mm Width), 14-SOL

Bandwidth

20 kHz

Current, Supply

7.5 mA

Harmonic Distortion

0.25 %

Impedance, Thermal

120 °C/W

Package Type

SOIC-14

Temperature, Operating, Range

-40 to +85 °C

Voltage, Input

1 V

Voltage, Noise

17 nV/sqrt Hz

Voltage, Supply

4.5 to 5.5 V

No. Of Channels

Supply Voltage Range

4.5V To 5.5V

Load Impedance

75ohm

Operating Temperature Range

-40Â°C To +85Â°C

Amplifier Case Style

SOIC

No. Of Pins

Msl

MSL 1 - Unlimited

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Max Output Power X Channels @ Load

Lead Free Status / Rohs Status

RoHS Compliant part Electrostatic Device

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

SSM2166SZ

Manufacturer:

ADI/亚德诺

Quantity:

20 000

Company:

H&T Electronics

Part Number:

SSM2166SZ

Quantity:

1 000

Company:

Amily Shenzhen XNWY Technology Co., Ltd

Part Number:

SSM2166SZ-REEL7

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This notice is to inform you of a change that will be made to certain ADI products (see Material Report). Any issues with this PCN or requirements to

qualify the change (additional data or samples) must be sent to ADI within 30 days of receiving this notification. ADI contact information is listed

below.

Revision Description*:

PCN Title:

Publication Date:

Samples Available Date:

Effectivity Date:

Description Of Change

Reason For Change

Anticipated impact of the change (positive or negative) on fit, form, function & reliability

Product Identification (this section will describe how to identify the changed material)

Summary of Supporting Information

Comments

Initial Release

1) Process Changed from ECL to HVBP2

2) Fab location change from ADI Santa Clara CA, to ADI Limerick, Ireland

3) Wafer Size Changed from 4" to 8"

4) Circuit layout and topology changed to meet new process design rules and existing product performance criteria.

5) Requires changes to external passive component values (vs previous die revision) to achieve similar output response vs input signals.

1) Product was originally designed and manufactured on the ECL technology platform which was obsoleted with the Analog Device closure of the 4" wafer

Fab facility in Santa Clara CA.

2) The new die provides for ongoing manufacture and supply of SSM2166 to existing and new customers

3) Re-design of the product was required to allow manufacture using the new fab process.

Customers using the previous version of SSM2166 will need to change external passive component values to achieve similar I/O response when using the new

die version. Recommended external component values for the new version are given in the revised datasheet rev D or later.

An "A" Indentifier has been added to the part name on the top mark. (See Examples of top mark below)

PB-Free

Top #1: SSM

Top #2: 2166A

Top #3: #

SnPb

Top #1: SSM

Top #2: 2166A

Top #3:

Qualification was performed per ADI0012. Reliability Report 6956 - SSM2166 Die Revision is attached

Final Die Revision was released in July of 2008. This was a follow-up notification of change. Customers with active backlog and/or recent buying history were

contacted during the redesign process, prior to shipment of the new die revision.

Supporting Documents

Attachment 1: ADI_PCN_08_0152_Rev_-_Reliability Report 6956.pdf

Product/Process Change Notice - PCN 08_0152 Rev. -

Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106

SSM2166, New Design and Conversion to new wafer fabrication process

24-Mar-2009

08-Dec-2008

08-Dec-2008 (the earliest date that a customer could expect to receive changed material)

Analog Devices, Inc. PCN 08_0152_Rev_- Page 1 of 4

Related parts for SSM2166SZ

SSM2166SZ Summary of contents

Page 1

Product/Process Change Notice - PCN 08_0152 Rev. - Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106 This notice is to inform you of a change that will be made to certain ADI products (see Material Report). Any issues with ...

Page 2

For questions on this PCN, send email to the regional contacts below or contact your local ADI sales representitive Americas: PCN_Americas@analog.com Europe: PCN_Europe@analog.com Analog Devices, Inc. PCN 08_0152_Rev_- Page Japan: PCN_Japan@analog.com Rest of Asia: PCN_ROA@analog.com ...

Page 3

... Appendix A - Affected ADI Parts - Generic Number / Material Number (6) SSM2166 / SSM2166S SSM2166 / SSM2166S-REEL SSM2166 / SSM2166S-REEL7 SSM2166 / SSM2166SZ Analog Devices, Inc. PCN 08_0152_Rev_- Page SSM2166 / SSM2166SZ-REEL SSM2166 / SSM2166SZ-REEL7 ...

Page 4

Rev Publish Date Rev. - 24-Mar-2009 Initial Release Appendix B - Revision History Rev Description Analog Devices, Inc. Proprietary Information Analog Devices, Inc. PCN 08_0152_Rev_- Page DocId:579 Parent DocId:None ...

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