NTD6600N ON Semiconductor, NTD6600N Datasheet
NTD6600N
Specifications of NTD6600N
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NTD6600N Summary of contents
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... N−Channel MARKING DIAGRAMS 4 Drain 4 DPAK CASE 369C (Surface Mounted) STYLE Drain Gate Source 4 Drain 4 DPAK−3 CASE 369D (Straight Lead) STYLE Gate Drain Source Y = Year WW = Work Week NT6600 = Device Code G = Pb−Free Package ORDERING INFORMATION Publication Order Number: NTD6600N/D ...
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... Switching characteristics are independent of operating junction temperature. ORDERING INFORMATION Device NTD6600N NTD6600N−1 NTD6600N−1G NTD6600NT4 NTD6600NT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTD6600N (T = 25°C unless otherwise noted) C ...
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... DRAIN CURRENT (A) D Figure 3. On−Resistance versus Drain Current and Temperature 2 2. 2.0 1.75 1.5 1.25 1.0 0.75 0.5 −50 − JUNCTION TEMPERATURE (°C) J Figure 5. On−Resistance Variation with Temperature NTD6600N TYPICAL CHARACTERISTICS 25° ≥ 3 3 150° 2 Figure 2. Transfer Characteristics 0. 25° ...
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... Figure 9. Resistive Switching Time Variation versus Gate Resistance 1000 SINGLE PULSE T = 25°C 100 C 10 1.0 R LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0.1 1 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area NTD6600N TYPICAL CHARACTERISTICS 25° ...
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... 0.13 (0.005 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD6600N PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6.20 3.0 0.244 ...
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... S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 −−− 3.93 −−− STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTD6600N/D ...