NTD4815N-35G ON Semiconductor, NTD4815N-35G Datasheet - Page 2

MOSFET N-CH 35A 30V IPAK TRIMMED

NTD4815N-35G

Manufacturer Part Number
NTD4815N-35G
Description
MOSFET N-CH 35A 30V IPAK TRIMMED
Manufacturer
ON Semiconductor
Series
-r
Datasheet

Specifications of NTD4815N-35G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
15 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
6.9A
Vgs(th) (max) @ Id
2.5V @ 250µA
Gate Charge (qg) @ Vgs
6.6nC @ 4.5V
Input Capacitance (ciss) @ Vds
770pF @ 12V
Power - Max
1.26W
Mounting Type
Through Hole
Package / Case
IPak, TO-251, DPak (3 straight short leads + tab)
Transistor Polarity
N Channel
Continuous Drain Current Id
35A
Drain Source Voltage Vds
30V
On Resistance Rds(on)
15mohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
2.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD4815N-35G
Manufacturer:
ON
Quantity:
12 500
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
THERMAL RESISTANCE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
OFF CHARACTERISTICS
ON CHARACTERISTICS (Note 3)
CHARGES AND CAPACITANCES
SWITCHING CHARACTERISTICS (Note 4)
3. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
4. Switching characteristics are independent of operating junction temperatures.
Junction−to−Case (Drain)
Junction−to−TAB (Drain)
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – Steady State (Note 2)
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage
Temperature Coefficient
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
Gate Threshold Voltage
Negative Threshold Temperature
Coefficient
Drain−to−Source On Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
Total Gate Charge
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Parameter
Parameter
(T
J
= 25°C unless otherwise specified)
V
V
V
Symbol
Q
Q
V
GS(TH)
(BR)DSS
R
t
(BR)DSS
Q
t
d(OFF)
C
I
C
G(TOT)
I
d(ON)
GS(TH)
C
G(TOT)
Q
DS(on)
Q
DSS
GSS
g
G(TH)
T
OSS
RSS
t
t
ISS
FS
GS
GD
r
f
J
/T
/
http://onsemi.com
J
V
V
V
GS
GS
GS
V
V
V
V
V
GS
= 4.5 V, V
= 0 V, f = 1.0 MHz, V
= 4.5 V, V
2
DS
V
GS
V
GS
V
GS
11.5 V
V
DS
GS
GS
= 10 V to
DS
= 24 V
= 4.5 V
= 11.5 V, V
= 0 V,
Test Condition
= 0 V, V
= V
= 0 V, I
= 15 V, I
R
I
G
D
DS
DS
DS
= 30 A
= 3.0 W
, I
= 15 V, I
D
GS
= 15 V; I
D
= 250 mA
D
DS
= 250 mA
= ±20 V
= 10 A
= 15 V;
T
T
I
J
I
I
I
D
J
D
D
D
DS
D
= 125°C
D
= 25 °C
= 15 A
= 30 A
= 15 A
= 30 A
= 15 A,
= 30 A
= 12 V
R
Symbol
qJC−TAB
R
R
R
qJC
qJA
qJA
Min
30
1.5
18.3
14.1
10.5
21.4
11.4
Typ
11.5
770
181
108
3.5
25
5.6
6.0
6.0
0.9
2.5
3.1
12
21
Value
119
4.6
3.5
78
±100
Max
10
2.5
6.6
15
25
1
mV/°C
mV/°C
°C/W
Unit
Unit
mW
mA
nA
nC
ns
nC
pF
V
V
S

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