TPCS8105(TE12L,Q,M Toshiba, TPCS8105(TE12L,Q,M Datasheet
TPCS8105(TE12L,Q,M
Specifications of TPCS8105(TE12L,Q,M
Related parts for TPCS8105(TE12L,Q,M
TPCS8105(TE12L,Q,M Summary of contents
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... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ...
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Thermal Characteristics Characteristics Thermal resistance, channel to ambient ( (Note 2a) Thermal resistance, channel to ambient ( (Note 2b) Marking (Note 5) S8105 A line indicates Lot No. lead (Pb)-free package or lead (Pb)-free ...
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Electrical Characteristics Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time Fall time Turn-OFF ...
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I – −10 −10 −2.5 −2.4 Common source Ta = 25°C −5 Pulse test −3 −8 −2.6 −2.3 −6 −2.2 − −2 V −2 0 −0.2 −0.4 −0.6 −0.8 0 Drain−source voltage V (V) ...
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R – (ON) 20 Common source −11 A Pulse test 16 − − −4 V −2.5 − − −80 −40 ...
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Device mounted on a glass-epoxy board (a) (Note 2a) (1) Single-device operation (Note 3a) (2) Single-device value at dual operation (Note 3b) Device mounted on a glass-epoxy board (b) (Note 2b) (3) Single-device operation (Note 3a) (4) Single-device value ...
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... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...