DBKL-25SAT-F Cinch Connectors, DBKL-25SAT-F Datasheet - Page 4

• Manufacturer Part Number: DBKL-25SAT-F
• Description: Connector,D-Shell,PCB Mount,PLUG,25 Contacts,SKT,0.109 Pitch,PC TAIL Terminal,#4-40
• Manufacturer: Cinch Connectors
• Series: DBKLr

Specifications of DBKL-25SAT-F

• Connector Style: D-Sub
• Number Of Positions: 25
• Number Of Rows: 2
• Shell Size, Connector Layout: 3 (DB, B)
• Contact Type: Signal
• Connector Type: Receptacle, Female Sockets
• Mounting Type: Through Hole, Right Angle
• Flange Feature: Mating Side; Female Screwlock (4-40), Removable
• Termination: Solder
• Features: Board Lock, Shielded
• Shell Material, Finish: Steel, Tin Plated
• Contact Finish: Gold
• Contact Finish Thickness: Flash
• Operating Temperature: -55°C ~ 125°C
• Current Rating: 5A
• Housing Material: Polyester, Glass Filled
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: Q986030

The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
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