CZP1JFTTE600P KOA Speer Electronics, CZP1JFTTE600P Datasheet - Page 7

• Manufacturer Part Number: CZP1JFTTE600P
• Description: 60 2000MA SM POWER FERRITE BEAD 0603 25%
• Manufacturer: KOA Speer Electronics
• Series: CZPr

Specifications of CZP1JFTTE600P

• Dimensions: 0.5 mm Dia. x 0.8 mm W x 1.6 mm L x 0.8 mm H
• Shielding: Shielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Tolerance: 25 %
• Maximum Dc Current: 500 mAmps
• Maximum Dc Resistance: 0.1 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

5. Characteristics
Bolivar Drive
Spe cific at io ns g ive n herein m ay be ch anged a t any tim e w ith out p rior not ice. Pleas e c onf ir m t echn ic al s pec ifica tions before you order an d/or u se.
Item
Operating Temperature
Storage Temperature
Resistance to Solder
Heat
Solderability
Leach Resistance
Insulation Resistance
Solvent Resistance
Terminal Strength
(hanging test)
Terminal Strength
(push test)
Bending Strength
P.O. Box 547
Requirement
-55°C ~ +125°C
40°C @ 70% Humidity
Change in Impedance: Relative to value before
test ±20%.
Appearance: There shall be no cracking
Solder Coverage: More than 75% of the terminal
electrode shall be covered with solder.
Solder Coverage: More than 95% of the
termination shall be covered with solder.
Appearance: There shall be no visible signs of
physical or mechanical damage (i.e. no cracks).
Terminations: Termination must not be leached
away for more than 5%.
Insulation Resistance: Min 1G ohms
Change in Impedance: Relative to value before
test ±10%.
Appearance: The terminal electrode shall not
break off, nor shall there be damage to the body.
Appearance: There shall be no evidence of
mechanical degradations to terminals or body.
Appearance: There shall be no physical or
mechanical damage.
Impedance: Relative to initial value before test
±10%.
Bradford, PA 16701
USA
814-362-5536
Conditions
Sealed plastic bags with desiccant shall be
used to reduce the potential of oxidation on
the terminations during storage.
Flux: 5-10 sec dip
After Flux: Air dry for 15 sec
Preheat: 150°C ±10°C
Preheat Time: 60 sec
Solder Temp: 260°C ±5°C
Dip Time: 10 ±1 sec
Flux: 5-10 sec dip
After Flux: Air dry for 15 sec
Solder Temp: 245°C ±5°C
Dip Time: 5 ±0.5 sec
The bead shall be subjected to the following
5 steps for the period of time shown below.
The 5 steps constitute one (1) rotation.
4 rotations shall be carried out.
1) Flux: 5-10 sec
2) After Flux: Air dry for 15 sec
3) Solder Temp: 230°C ±5°C
4) Dip Time: 5 ±0.5 sec
5) Cool: Air cool for 60 seconds
Cleaning by:
Washer: Ultrasonic washer (100W)
Solvent: Isopropyl alcohol
Time: 3 minutes
Board: 90x40x1.6mm
Bend: 1mm
Time: 5 sec
Type
Type
Fax [phone]
2A
2B
2A
2B
1J
1J
W(kgf)
W(kgf)
0.5
1.0
1.5
1.4
1.8
2.3
www.koaspeer.com
30 sec ±2 sec
30 sec ±2 sec
30 sec ±2 sec
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60 sec
60 sec
60 sec
Time
Time
SS-220 R12