NTD2955-1G ON Semiconductor, NTD2955-1G Datasheet
NTD2955-1G
Specifications of NTD2955-1G
NTD2955-1GOS
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NTD2955-1G Summary of contents
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... NTD2955, NTD2955P Power MOSFET -60 V, -12 A, P-Channel DPAK This Power MOSFET is designed to withstand high energy in the avalanche and commutation modes. Designed for low-voltage, high- speed switching applications in power supplies, converters, and power motor controls. These devices are particularly well suited for bridge ...
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... Reverse Recovery Time ( /dt = 100 A/ Reverse Recovery Stored Charge 3. Indicates Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperature. NTD2955, NTD2955P (T = 25°C unless otherwise noted) J Symbol V (BR)DSS = 0 Vdc 6.0 Adc -25 Vdc, V ...
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... DRAIN CURRENT (AMPS) D Figure 3. On-Resistance versus Drain Current and Temperature 2 - 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0 100 T , JUNCTION TEMPERATURE (°C) J Figure 5. On-Resistance Variation with Temperature NTD2955, NTD2955P (T = 25°C unless otherwise noted ≥ GATE-TO-SOURCE VOLTAGE (VOLTS) GS Figure 2. Transfer Characteristics ...
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... Variation versus Gate Resistance 100 SINGLE PULSE T = 25° 100 LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN-TO-SOURCE VOLTAGE (V) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area NTD2955, NTD2955P 25° 12 iss 5 C oss 2.5 C rss Figure 8. Gate-To-Source and Drain-To-Source ...
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... D = 0.5 0.2 0.1 0.05 0.1 0.02 0.01 SINGLE PULSE 0.01 1.0E-05 1.0E-04 1.0E-03 NTD2955, NTD2955P P (pk DUTY CYCLE 1.0E-02 1.0E-01 t, TIME (s) Figure 13. Thermal Response http://onsemi.com 5 R (t) = r(t) R qJC qJC D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME (t) qJC J(pk) ...
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... ORDERING INFORMATION Device NTD2955 NTD2955G NTD2955-001 NTD2955-1G NTD2955T4 NTD2955T4G NTD2955PT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTD2955, NTD2955P Package DPAK DPAK (Pb-Free) DPAK-3 DPAK-3 (Pb-Free) ...
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... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD2955, NTD2955P PACKAGE DIMENSIONS DPAK CASE 369C-01 ISSUE O SEATING -T- PLANE SOLDERING FOOTPRINT* 6.20 3.0 0.244 0.118 2.58 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com NTD2955, NTD2955P PACKAGE DIMENSIONS DPAK-3 CASE 369D-01 ISSUE ...