NTD4963NT4G ON Semiconductor, NTD4963NT4G Datasheet - Page 2

• Manufacturer Part Number: NTD4963NT4G
• Description: MOSFET N-CH 30V 8.1A DPAK
• Manufacturer: ON Semiconductor

Specifications of NTD4963NT4G

• Package / Case: DPak, TO-252 (2 leads+tab), SC-63
• Mounting Type: Surface Mount
• Power - Max: 1.1W
• Fet Type: MOSFET N-Channel, Metal Oxide
• Gate Charge (qg) @ Vgs: 16.2nC @ 10V
• Vgs(th) (max) @ Id: 2.5V @ 250µA
• Current - Continuous Drain (id) @ 25° C: 8.1A
• Drain To Source Voltage (vdss): 30V
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 9.6 mOhm @ 30A, 10V
• Configuration: Single
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 13.6 mOhms
• Forward Transconductance Gfs (max / Min): 40 S
• Drain-source Breakdown Voltage: 30 V
• Continuous Drain Current: 44 A
• Power Dissipation: 35.7 W
• Maximum Operating Temperature: + 175 C
• Mounting Style: SMD/SMT
• Gate Charge Qg: 8.1 nC
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
4. Surface−mounted on FR4 board using the minimum recommended pad size.
THERMAL RESISTANCE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
OFF CHARACTERISTICS
ON CHARACTERISTICS (Note 5)
CHARGES, CAPACITANCES AND GATE RESISTANCE
SWITCHING CHARACTERISTICS (Note 6)
5. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
6. Switching characteristics are independent of operating junction temperatures.
7. Assume terminal length of 110 mils.
Junction−to−Case (Drain)
Junction−to−TAB (Drain)
Junction−to−Ambient – Steady State (Note 3)
Junction−to−Ambient – Steady State (Note 4)
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage
Temperature Coefficient
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
Gate Threshold Voltage
Negative Threshold Temperature
Coefficient
Drain−to−Source On Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
Total Gate Charge
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Parameter
Parameter
(T
J
= 25°C unless otherwise specified)
V
V
V
Symbol
Q
Q
V
GS(TH)
(BR)DSS
R
t
(BR)DSS
Q
t
d(OFF)
C
I
C
G(TOT)
I
d(ON)
GS(TH)
C
G(TOT)
Q
DS(on)
Q
DSS
GSS
g
G(TH)
T
OSS
RSS
t
t
ISS
FS
GS
GD
r
f
J
/T
/
http://onsemi.com
J
V
V
V
GS
GS
GS
V
V
V
V
= 0 V, f = 1.0 MHz, V
V
= 4.5 V, V
= 10 V, V
2
DS
V
GS
V
GS
V
GS
GS
V
I
DS
D
GS
GS
DS
= 24 V
= 4.5 V
= 15 A, R
= 0 V,
= 10 V
Test Condition
= 4.5 V, V
= 0 V, V
= V
= 0 V, I
= 1.5 V, I
DS
DS
DS
, I
= 15 V, I
D
GS
= 15 V, I
D
G
DS
= 250 mA
D
= 250 mA
= 3.0 W
= ±20 V
= 30 A
= 15 V,
T
T
I
I
J
I
I
D
D
D
D
DS
J
D
= 125°C
D
= 25°C
= 15 A
= 15 A
= 30 A
= 30 A
= 30 A
= 30 A
= 12 V
R
Symbol
qJC−TAB
R
R
R
qJC
qJA
qJA
Min
1.45
30
13.6
1035
16.2
Typ
13.6
8.2
220
115
25
8.2
8.1
1.2
3.5
3.5
12
20
14
40
3
5
Value
118
4.1
3.5
77
±100
Max
1.0
10
2.5
9.6
16
mV/°C
mV/°C
°C/W
Unit
Unit
mW
mA
nA
nC
ns
nC
pF
V
V
S