AOL1432 Alpha & Omega Semiconductor Inc, AOL1432 Datasheet - Page 2

MOSFET N-CH 25V 44A ULTRA SO-8

AOL1432

Manufacturer Part Number
AOL1432
Description
MOSFET N-CH 25V 44A ULTRA SO-8
Manufacturer
Alpha & Omega Semiconductor Inc
Datasheet

Specifications of AOL1432

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
8.5 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
25V
Current - Continuous Drain (id) @ 25° C
44A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
32nC @ 10V
Input Capacitance (ciss) @ Vds
1716pF @ 12.5V
Power - Max
30W
Mounting Type
Surface Mount
Package / Case
SO-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
785-1126-2

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AOL1432
Alpha & Omega Semiconductor, Ltd.
Electrical Characteristics (T
Symbol
STATIC PARAMETERS
BV
I
I
V
I
R
g
V
I
DYNAMIC PARAMETERS
C
C
C
R
SWITCHING PARAMETERS
Q
Q
Q
Q
t
t
t
t
t
Q
A: The value of R
Power dissipation P
the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation P
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature T
D. The R
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of T
G. Surface mounted on a 1 in
H. These tests are performed with the device mounted on 1 in
curve provides a single pulse rating.
* This device is guaranteed green after date code 8P11 (June 1
Rev 3: Jul 2008
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
DSS
GSS
D(ON)
S
D(on)
r
D(off)
f
rr
FS
GS(th)
SD
DS(ON)
iss
oss
rss
g
g
g
gs
gd
rr
(10V)
(4.5V)
DSS
θJA
is the sum of the thermal impedence from junction to case R
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge I
θJA
DSM
is measured with the device mounted on 1in
is based on R
D
is based on T
2
FR-4 board with 2oz. Copper.
Parameter
J
J(MAX)
θJA
=25°C unless otherwise noted)
and the maximum allowed junction temperature of 150°C. The value in any given application depends on
J(MAX)
=175°C.
=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
2
ST
FR-4 board with 2oz. Copper, in a still air environment with T
Conditions
I
V
V
V
V
V
V
V
I
V
V
V
V
R
I
J(MAX)
D
S
F
F
2
2008)
DS
DS
DS
GS
GS
GS
DS
GS
GS
GS
GS
GEN
=20A, dI/dt=100A/µs
=20A, dI/dt=100A/µs
=250uA, V
=1A, V
FR-4 board with 2oz. Copper, in a still air environment with T
=20V, V
=0V, V
=V
=5V, I
=10V, V
=10V, I
=4.5V, I
=0V, V
=0V, V
=10V, V
=10V, V
=175°C.
=3Ω
GS
θJC
GS
, I
D
and case to ambient.
GS
DS
DS
D
=10A
=0V
D
D
GS
=250µA
DS
DS
DS
=30A
GS
=±20V
=12.5V, f=1MHz
=0V, f=1MHz
=20A
=0V
=5V
=12.5V, I
=12.5V, R
=0V
T
D
L
T
=20A
J
=0.6Ω,
=125°C
J
=55°C
Min
100
25
1
23.06
15.25
1430
11.5
0.72
26.4
13.5
7.75
22.7
Typ
319
215
1.8
6.5
9.5
1.2
3.9
6.5
6.2
35
10
A
=25°C. The SOA
A
1716
Max
27.5
=25°C. The
100
8.5
12
14
55
32
1
5
3
1
2
www.aosmd.com
Units
mΩ
mΩ
nC
nC
nC
nC
nC
µA
nA
pF
pF
pF
ns
ns
ns
ns
ns
V
V
A
S
V
A

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