IRF6716MTRPBF International Rectifier, IRF6716MTRPBF Datasheet - Page 3

• Manufacturer Part Number: IRF6716MTRPBF
• Description: MOSFET N-CH 25V 39A DIRECTFET
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6716MTRPBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 1.6 mOhm @ 40A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 39A
• Vgs(th) (max) @ Id: 2.4V @ 100µA
• Gate Charge (qg) @ Vgs: 59nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 5150pF @ 13V
• Power - Max: 3.6W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric MX
• Transistor Polarity: N Channel
• Continuous Drain Current Id: 39A
• Drain Source Voltage Vds: 25V
• On Resistance Rds(on): 1.2mohm
• Rds(on) Test Voltage Vgs: 10V
• Threshold Voltage Vgs Typ: 1.9V
• Rohs Compliant: Yes
• Resistance Drain-source Rds (on): 2.6 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 39 A
• Power Dissipation: 78 W
• Gate Charge Qg: 39 nC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant


‚
ƒ
air).
Notes:
Absolute Maximum Ratings
P
P
P
T
T
T
Thermal Resistance
R
R
R
R
R
 Surface mounted on 1 in. square Cu (still
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1E-006
1
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fg
f
dg
eg
g
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
‚
small clip heatsink (still air)
0.01
„
…
T
R
C
θ
τ
J
τ
measured with thermocouple incontact with top (Drain) of part.
is measured at
J
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
0.1
R
1
R
1
with
τ
2
τ
R
2
2
R
T
2
1
J
Typ.
12.5
of approximately 90°C.
–––
–––
1.0
20
R
τ
3
3
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
τ
3
3
τ
-40 to + 150
A
τ
A
Ri (°C/W)
Max.
0.031
footprint full size board with
metalized back and with small
clip heatsink (still air)
10
ƒ Mounted on minimum
270
3.6
2.3
78
2.003
17.536
15.465
Max.

–––
–––
–––
1.6
35
100
0.000686
0.78614
28
τi (sec)
1000
Units
Units
°C/W
W/°C
°C
W
3