5044S30 Cinch Connectors, 5044S30 Datasheet - Page 4

• Manufacturer Part Number: 5044S30
• Description: Edge Connector,PCB Mount,RECEPT,44 Contacts,0.156 Pitch,EDGE MOUNT Terminal,HOLE .125-.137
• Manufacturer: Cinch Connectors
• Type: Card Edger

Specifications of 5044S30

• Number Of Contacts: 44POS
• Number Of Contact Rows: 2
• Body Orientation: Straight
• Contact Plating: Gold Over Nickel
• Contact Material: Beryllium Copper
• Termination Method: Solder Lug
• Mounting Style: Panel
• Product Height (mm): 8.64mm
• Operating Temp Range: -65C to 125C
• Pitch (mm): 3.96mm
• Housing Material: Diallyl Phthalate
• Housing Color: Green
• Current Rating (max): 5A
• Contact Resistance Max: 5
• Lead Free Status / RoHS Status: Compliant

The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
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